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公开(公告)号：US11246239B2
公开(公告)日：2022-02-08
申请号：US17027182
申请日：2020-09-21
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke Watanabe , Kenya Kawabata , Yoshikatsu Inagaki , Tatsuro Miura , Kazuaki Aotani , Toshiaki Nakamura
IPC: H05K7/20
Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.
A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is thermally connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, and a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is larger than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion.-
公开(公告)号：US11112186B2
公开(公告)日：2021-09-07
申请号：US17010599
申请日：2020-09-02
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke Watanabe , Kenya Kawabata , Yoshikatsu Inagaki , Tatsuro Miura , Kazuaki Aotani , Toshiaki Nakamura
Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.
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Patent Agency Ranking
公开(公告)号：US10996001B2
公开(公告)日：2021-05-04
申请号：US17009206
申请日：2020-09-01
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke Watanabe , Kenya Kawabata , Yoshikatsu Inagaki , Tatsuro Miura , Kazuaki Aotani , Toshiaki Nakamura
Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.
A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; a pipe body connected to a heat radiating portion of the heat transport member; and a heat radiating fin group which is thermally connected to the pipe body and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the pipe body and that is filled with a working fluid, the internal space of the heat transport member communicating with an internal space of the pipe body, and a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is smaller than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion.-
公开(公告)号：US10976112B2
公开(公告)日：2021-04-13
申请号：US16677160
申请日：2019-11-07
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kenya Kawabata , Yoshikatsu Inagaki
Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases. A heat pipe including: a container having a tubular shape in which an end surface of one end part and an end surface of another end part are sealed, the container including an inner wall surface in which a groove part is formed; a sintered body layer provided on the inner wall surface of the container, the sintered body layer being formed by sintering a powder; and a working fluid sealed in a hollow part of the container, wherein: the sintered body layer includes a first sintered part located in an evaporation part of the heat pipe, and a second sintered part located in a heat insulation part between the evaporation part and a condensation part of the heat pipe, the second sintered part being continuous with the first sintered part, and a capillary force of the first sintered part is larger than a capillary force of the second sintered part.
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公开(公告)号：US10677534B1
公开(公告)日：2020-06-09
申请号：US16779146
申请日：2020-01-31
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yosuke Watanabe , Tatsuro Miura , Toshiaki Nakamura , Kenya Kawabata , Yoshikatsu Inagaki
Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.The heat sink includes: a heat transport member having a heat receiving portion thermally connected to a heat-generating element and including a first wick structure; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member and including a second wick structure; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which, the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, the internal space of the heat transport member communicating with an internal space of the tube body, and the first wick structure includes a branch portion branched in a thickness direction of the heat transport member and multi-stage stem parts extending from the branch portion in a predetermined direction.
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公开(公告)号：US10598441B2
公开(公告)日：2020-03-24
申请号：US15813035
申请日：2017-11-14
Applicant: Furukawa Electric Co., Ltd.
Inventor： Kenya Kawabata , Masahiro Meguro , Kuang Yu Chu , Hung Wei Tseng
IPC: F28D15/02 , H01L23/36 , H01L23/427 , F28F1/34 , F28F1/32 , F28D21/00 , H01L23/367
Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.
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公开(公告)号：US20150219400A1
公开(公告)日：2015-08-06
申请号：US14423002
申请日：2013-12-04
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yasumi Sasaki , Kenya Kawabata
CPC classification number: F28D15/0275 , F28D15/0233 , F28D15/04 , F28F1/32 , H01L21/4882 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A heat sink that can reduce a load imposed on a heat pipe and enhance a heat transfer efficiency from a heating body to a heat radiation fin is provided.The heat sink has a base plate 21 having a heat receiving portion to which a semiconductor device 11 is thermally connected, a heat pipe disposed on the base plate 21 while partially brought into contact with the heat receiving portion, and a heat radiation fin arranged to be stacked on the base plate 21 and the heat pipe 22. The base plate 21 is formed of a metal plate and has an opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 which is formed of a metal plate having higher thermal conductivity than the base plate 21 is arranged to form substantially the same plane with the base plate 21.
Abstract translation: 提供一种可以减少施加在热管上的负载并提高从加热体到散热片的传热效率的散热器。 散热器具有底板21，其具有与半导体器件11热连接的热接收部分，设置在基板21上的部分地与热接收部分接触的热管，以及布置成 堆叠在基板21和热管22上。基板21由金属板形成，并且在与受热部对应的位置处具有开口部35，并且受热板36由 具有比基板21更高的导热性的金属板被布置成与基板21基本上形成相同的平面。
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