公开(公告)号：US06200831B1

公开(公告)日：2001-03-13

申请号：US09528439

申请日：2000-03-17

申请人： Jun Tanaka ,  Fumio Kataoka ,  Haruhiko Kikkawa ,  Isao Obara ,  Keiko Isoda

发明人： Jun Tanaka ,  Fumio Kataoka ,  Haruhiko Kikkawa ,  Isao Obara ,  Keiko Isoda

IPC分类号： H01L2144

CPC分类号： H01L23/3171 ,  C08G73/10 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/274 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: wherein R1 is a trivalent or tetravalent aromatic group; R2 and R3 are each a tetravalent organic group having 4 or more carbon atoms; R4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).

摘要翻译： 在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物， 由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。