CLEANING EQUIPMENT AND CLEANING METHOD OF DEPOSITION MASK
    1.
    发明申请
    CLEANING EQUIPMENT AND CLEANING METHOD OF DEPOSITION MASK 失效
    清洗设备和清洁方法沉积掩模

    公开(公告)号:US20100101601A1

    公开(公告)日:2010-04-29

    申请号:US12551821

    申请日:2009-09-01

    IPC分类号: B08B3/00 B08B7/04

    CPC分类号: H01L21/67028

    摘要: Equipment is realized which is capable of increasing the frequency of use of a deposition mask of an organic EL element and the recycle of an adhesive agent by efficiently cleaning the deposition mask with little damage and efficiently collecting the adhesive agent. A pulse laser is irradiated to a deposition mask to separate the deposition agent from the deposition mask. The separated deposition agent is sucked by a suction nozzle, and the deposition agent is separated from air by a cyclone and deposited on a bottom of the cyclone. Thereafter, a first valve is opened to collect the deposition agent in a deposition agent collection section. Then a second valve is opened to move the deposition agent to a deposition agent refining section to be refined. A third valve is opened to store the refined deposition agent in a deposition agent storage section. The deposition mask may be cleaned without being damaged to collect the deposition agent with high efficiency.

    摘要翻译: 实现了能够通过有效地清洁沉积掩模并且有效地收集粘合剂来增加有机EL元件的沉积掩模的使用频率和粘合剂的再循环的设备。 将脉冲激光照射到沉积掩模以将沉积剂与沉积掩模分离。 分离的沉积剂通过吸嘴吸入,并且沉积剂通过旋风分离器与空气分离并沉积在旋风分离器的底部。 此后,打开第一阀门以将沉积剂收集在沉积剂收集部分中。 然后打开第二个阀,以将沉积剂移动到要精炼的沉积剂精炼部分。 第三阀被打开以将精制的沉积剂存储在沉积剂储存部分中。 可以清洁沉积掩模而不损坏以高效率收集沉积剂。

    Photosensitive resin composition and method for forming fine patterns
with said composition
    4.
    发明授权
    Photosensitive resin composition and method for forming fine patterns with said composition 失效
    光敏树脂组合物和用所述组合物形成精细图案的方法

    公开(公告)号:US4554237A

    公开(公告)日:1985-11-19

    申请号:US452198

    申请日:1982-12-22

    CPC分类号: G03F7/008 Y10S430/128

    摘要: Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

    摘要翻译: 公开了用于在半导体器件上形成精细图案的光敏树脂组合物,具有高度敏感性和显影性优异的并且没有问题,例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀,以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含(a)至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和(b)由通式(1)表示的叠氮化合物:其中 X是-N3或-SO2N3,Y是低级亚烷基,例如-CH2CH2-,-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-,羟基亚烷基或氨基亚烷基,例如

    Polyimide precursor, cured product thereof, and processes for producing
them
    9.
    发明授权
    Polyimide precursor, cured product thereof, and processes for producing them 失效
    聚酰亚胺前体,其固化物及其制造方法

    公开(公告)号:US5272247A

    公开(公告)日:1993-12-21

    申请号:US779986

    申请日:1991-10-21

    摘要: The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.

    摘要翻译: 本发明提供了具有小介电常数,小热膨胀系数,高耐热性,高玻璃化转变温度和高机械性能的聚酰亚胺,聚酰亚胺的前体及其制备方法。 其分子链包含由以下通式(1)表示的重复单元和由以下通式(2)表示的重复单元的聚酰亚胺前体:其中R 1为至少一种 选自 R2的四价有机基团中的至少一种是具有线性结构的至少一种二价有机基团,其选自由以下组成的组: >和< IMAGE> m为1〜4的整数,R 3为含有至少2个芳香环的非线性结构的二价有机基团。

    Process for producing organic silicon-terminated polyimide precursor and
polyimide
    10.
    发明授权
    Process for producing organic silicon-terminated polyimide precursor and polyimide 失效
    有机硅封端聚酰亚胺前体和聚酰亚胺的制备方法

    公开(公告)号:US4748228A

    公开(公告)日:1988-05-31

    申请号:US863241

    申请日:1986-05-14

    IPC分类号: C08G73/00 C08G73/10 C08G77/00

    CPC分类号: C08G73/1017

    摘要: An organic silicon-terminated polyimide precursor having a very stable solution viscosity is produced by polycondensing 100 parts by weight of a mixture composed of 90 to 99.5% by mole of an organic diamine represented by the following general formula (I) and 10 to 0.5% by weight by mole of an organic silyl represented by the following general formula (II): ##STR1## wherein R.sup.1 and R.sup.2 are divalent organic groups; R.sup.3 and R.sup.4 are monovalent organic groups; m is 0, 1, 2, or 3, with an organic tetracarboxylic acid dianhydride represented by the following general formula (III) in a molar amount corresponding to the 100 parts by weight of the mixture of the organic diamine and the organic silyl represented by the said general formulae (I) and (II), respectively, in an organic polar solvent at 0.degree. to 40.degree. C., thereby obtaining a solution of organic silicon-terminated polyimide precursor, and heating the solution at 50.degree. to 80.degree. C.: ##STR2## wherein R.sup.5 is a tetravelent organic group. The polyimide having good adhesion and mechanical characteristics is obtained by further heating the precursor solution at 100.degree. to 450.degree. C.

    摘要翻译: 通过将100重量份由以下通式(I)表示的有机二胺和90至99.5摩尔%的由下列通式(I)表示的混合物和10至0.5重量%的混合物进行缩聚来制备具有非常稳定的溶液粘度的有机硅封端的聚酰亚胺前体, (II)表示的有机甲硅烷基:其中R 1和R 2是二价有机基团;其中R 1和R 2是二价有机基团; R3和R4是一价有机基团; m为0,1,2或3,与由以下通式(III)表示的有机四羧酸二酐的摩尔量相当于有机二胺和有机甲硅烷基的混合物的100重量份,由 所述通式(I)和(II)分别在有机极性溶剂中在0至40℃下进行,从而获得有机硅封端的聚酰亚胺前体溶液,并在50℃至80℃下加热该溶液 (III)其中R5是四价有机基团。 通过在100〜450℃下进一步加热前体溶液得到具有良好粘附性和机械特性的聚酰亚胺