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公开(公告)号:US07126547B2
公开(公告)日:2006-10-24
申请号:US10983634
申请日:2004-11-09
申请人: Hyun Hak Kim , Chul Ho Kim , Jeong Sik Seo , II Hwan Park
发明人: Hyun Hak Kim , Chul Ho Kim , Jeong Sik Seo , II Hwan Park
IPC分类号: H01Q1/24
CPC分类号: H01Q1/243 , H01Q1/38 , H01Q9/0421 , H01Q21/0025
摘要: An antenna module, which minimizes a space, in an electronic apparatus set, occupied thereby without changing characteristics thereof, improves a degree of freedom of the installation structure thereof to increase the space utilization of the set, and achieves miniaturization and multi-functionality of electronic apparatuses, and an electronic apparatus having the antenna module. The antenna module includes a PCB (printed circuit board) made of nonconductive material having flexibility; an antenna element mounted at a designated position of the upper surface of the PCB; a ground line formed on the PCB so that the ground line is connected to a ground terminal of the antenna element, and provided with a joint portion formed at one end thereof; a feeder line formed on the PCB so that the feeder line is connected to a signal terminal of the antenna element, and provided with a joint portion formed at one end thereof; and a passive line, having a designated length, formed on the PCB in parallel with the feeder line. The joint portions of the ground line and the feeder line are bonded to designated positions of a set of the wireless electronic apparatus, and a portion of the antenna module having the antenna element mounted on the PCB is located outside the set.
摘要翻译: 在不改变其特性的情况下使电子设备组中的空间最小化的天线模块提高了其安装结构的自由度,从而提高了组件的空间利用率,并实现了电子设备的小型化和多功能化 装置和具有天线模块的电子装置。 天线模块包括由具有柔性的非导电材料制成的PCB(印刷电路板) 安装在PCB的上表面的指定位置的天线元件; 形成在PCB上的接地线,使得接地线连接到天线元件的接地端子,并且在其一端设置有接合部分; 形成在PCB上的馈电线,使得馈线与天线元件的信号端子连接,并且在其一端设置有接合部分; 以及具有指定长度的无源线,其与馈线相平行地形成在PCB上。 接地线和馈电线的接合部分接合到一组无线电子设备的指定位置,并且具有安装在PCB上的天线元件的天线模块的一部分位于组外部。
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公开(公告)号:US08004466B2
公开(公告)日:2011-08-23
申请号:US12257556
申请日:2008-10-24
申请人: Hyun Hak Kim , Jong Kweon Park , Jung Nam Lee , Seok Min Woo
发明人: Hyun Hak Kim , Jong Kweon Park , Jung Nam Lee , Seok Min Woo
摘要: An antenna includes a dielectric substrate, a radiator disposed on one surface of the dielectric substrate, a feeding conductive pattern having one end connected with the radiator and the other end connected with an external feed line, a first slot disposed in the feeding conductive pattern, a ground plane disposed on the other surface of the dielectric substrate, and a second slot disposed on the ground plane.
摘要翻译: 天线包括电介质基板,布置在电介质基板的一个表面上的散热器,馈电导体图案,其一端与散热器连接,另一端与外部馈电线相连,设置在馈电导体图案中的第一槽, 设置在电介质基板的另一个表面上的接地平面和设置在接地平面上的第二槽。
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公开(公告)号:US07498990B2
公开(公告)日:2009-03-03
申请号:US11457393
申请日:2006-07-13
申请人: Il Hwan Park , Chul Ho Kim , Jong Lae Kim , Hyun Hak Kim
发明人: Il Hwan Park , Chul Ho Kim , Jong Lae Kim , Hyun Hak Kim
CPC分类号: H01Q1/243 , H01Q9/0421 , H01Q21/28
摘要: In an internal antenna, a first antenna part is disposed on a side of a mobile telecommunication terminal body having at least first and second peripheral surfaces and sides. The first antenna part processes a signal of a first band. Also, a second antenna part is disposed on one of the peripheral surfaces of the mobile telecommunication body. The second antenna part processes a signal of a second band.
摘要翻译: 在内部天线中,第一天线部件设置在具有至少第一和第二外围表面和侧面的移动通信终端主体的一侧上。 第一天线部分处理第一频带的信号。 此外,第二天线部件设置在移动电信主体的外围表面之一上。 第二天线部分处理第二频带的信号。
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公开(公告)号:US07002522B2
公开(公告)日:2006-02-21
申请号:US10893923
申请日:2004-07-20
申请人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Il Hwan Park , Jeong Sik Seo
发明人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Il Hwan Park , Jeong Sik Seo
IPC分类号: H01Q1/24
CPC分类号: H01Q1/2283 , H01Q1/22 , H01Q1/362 , H01Q1/38 , H01Q21/30
摘要: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.
摘要翻译: 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块,在该介质块中形成有导电图案的主天线装置,使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置,而相邻的单元层叠结构彼此连接,形成沿着Y轴的方向具有弯曲线结构的层叠结构,并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构,以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。
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公开(公告)号:US06992633B2
公开(公告)日:2006-01-31
申请号:US10859145
申请日:2004-06-03
申请人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Jeong Sik Seo , Il Hwan Park
发明人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Jeong Sik Seo , Il Hwan Park
IPC分类号: H01Q1/24
CPC分类号: H01Q9/0421 , H01Q1/243 , H01Q1/38 , H01Q5/385
摘要: Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.
摘要翻译: 这里公开了一种使用双重耦合馈电的多层芯片天线。 多层芯片天线包括第一馈电辐射元件,第一馈电辐射元件包括在第一馈电电极的一侧连接到馈电线的第一馈电电极,并且在第一馈电电极的另一侧连接到地表面,同时形成在第一平面上 所述第一馈电辐射元件连接到所述第一馈电电极,使得所述第一馈电辐射元件具有空间曲折线结构,第二馈电辐射元件在平行于所述第一馈电电极的第二平面上连接到所述第一馈电电极的一部分 第一平面,使得第二馈电辐射元件具有平面曲折线结构,在平行于第一平面的第三平面上连接到第一馈电电极的一部分的第二馈电电极,与第二馈电电耦合的第一寄生辐射元件 电极,以及电耦合到第二馈电电极的第二寄生辐射元件 并且包括多个寄生图案。
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公开(公告)号:US20050259012A1
公开(公告)日:2005-11-24
申请号:US10893923
申请日:2004-07-20
申请人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Il Hwan Park , Jeong Seo
发明人: Hyun Hak Kim , Chul Ho Kim , Gi Tae Do , Il Hwan Park , Jeong Seo
IPC分类号: H01Q9/42 , H01Q20060101 , H01Q1/22 , H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q5/00 , H01Q11/08 , H01Q13/08 , H01Q21/00 , H01Q21/30
CPC分类号: H01Q1/2283 , H01Q1/22 , H01Q1/362 , H01Q1/38 , H01Q21/30
摘要: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.
摘要翻译: 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块,在该介质块中形成有导电图案的主天线装置,使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置,而相邻的单元层叠结构彼此连接,形成沿着Y轴的方向具有弯曲线结构的层叠结构,并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构,以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。
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