WATERPROOF ELECTRICAL CONNECTOR
    21.
    发明申请

    公开(公告)号:US20180013229A1

    公开(公告)日:2018-01-11

    申请号:US15209746

    申请日:2016-07-13

    Applicant: GOOGLE INC.

    Abstract: This application is directed to a waterproof power adapter, which includes: a waterproof housing enclosing an AC to DC converter having an AC power supply input and a DC power supply output; a fixed, waterproof AC power connection for coupling an external power supply to the AC power supply input; a female connector, a portion of which is coupled within the housing to the DC power supply output, and an exposed portion of which is configured to couple a DC voltage provided at the DC power supply output to a complementary and separate male connector, the exposed portion being exposed when not coupled to the male connector; a sealing structure configured to engage with a cover of the male connector in a sealed position to provide a waterproof environment; and a locking mechanism configured to releasably tighten and lock the cover of the male connector in the sealed position.

    Heat Sink of a Camera
    22.
    发明申请

    公开(公告)号:US20180011390A1

    公开(公告)日:2018-01-11

    申请号:US15209740

    申请日:2016-07-13

    Applicant: GOOGLE INC.

    Abstract: This application is directed to a camera that includes a housing, a lens assembly and a plurality of electronic components. The lens assembly is arranged at a front portion of the housing and configured for focusing light received from outside of the camera. The plurality of electronic components is arranged at the front portion of the housing, and further includes an image sensor coupled to receive light through the lens assembly, a memory for storing information, a processor for processing information from the image sensor, and a wireless communication module for wirelessly communicating with an electronic device. The camera further includes a heat dissipation element arranged at a rear portion of the housing and located between the plurality of electronic components and a rear surface of the housing. The heat dissipation element is configured to transfer heat from the plurality of electronic components to the rear portion of the housing.

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