公开(公告)号：US06507993B2

公开(公告)日：2003-01-21

申请号：US09850216

申请日：2001-05-07

Applicant: Gregory Dunn

Inventor： Gregory Dunn

IPC: H01C1728

CPC classification number: H05K1/167 ,  H01C1/14 ,  H01C7/005 ,  H01C17/281 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/243 ,  H05K3/4664 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49128 ,  Y10T29/49156

Abstract: A method of manufacturing a printed circuit board with a polymer thick-film (PTF) resistor whose dimensions can be defined with improved precision by providing a circuit board construction having a planar surface where the resistor is to be deposited. To achieve the desired board construction, the interconnect for the resistor is pattern plated using a permanent photodielectric layer as a plating mask instead of a sacrificial plating resist. The interconnect can be patterned before or after the PTF resistor ink is printed. The x and z dimensions (width and thickness, respectively) of the resistor are determined by the deposition process, while the y dimension (electrical length) is accurately determined by copper terminations.

Abstract translation: 一种制造具有聚合物厚膜（PTF）电阻器的印刷电路板的方法，其尺寸可以通过提供具有要沉积电阻器的平面的电路板结构而以更高的精度来定义。 为了实现所需的电路板结构，使用永久光致电介质层作为电镀掩模而不是牺牲电镀抗蚀剂来对电阻器的互连进行图案电镀。 可以在打印PTF电阻墨水之前或之后对互连进行图案化。 电阻器的x和z尺寸（分别为宽度和厚度）由沉积过程确定，而y尺寸（电长度）由铜端子精确确定。