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    Cassettes with offset vias
    21.
    发明授权
    Cassettes with offset vias 有权

    公开(公告)号：US11065619B2

    公开(公告)日：2021-07-20

    申请号：US16472694

    申请日：2017-02-03

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Gary G. Lutnesky ,  Matthew David Smith ,  Dennis R. Esterberg

    IPC: B01L3/00 ,  H01R12/71 ,  H05K1/11 ,  B01L3/02

    Abstract: A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.

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