公开(公告)号：USD917066S1

公开(公告)日：2021-04-20

申请号：US29689292

申请日：2019-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Dennis R. Esterberg ,  Vignesh Kannan ,  Kenneth Ward ,  Christie Dudenhoefer

公开(公告)号：US11975547B2

公开(公告)日：2024-05-07

申请号：US17608078

申请日：2019-07-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Vignesh Kannan ,  Dennis R. Esterberg ,  Christie Dudenhoefer ,  Kenneth Ward ,  Matthew David Smith ,  Daniel Fradl

IPC: B41J29/13

CPC classification number: B41J29/13 ,  B01L2200/025 ,  B01L2200/0642 ,  B01L2300/0609 ,  H05K2201/10424 ,  H05K2201/10954

Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

公开(公告)号：USD1022931S1

公开(公告)日：2024-04-16

申请号：US29801988

申请日：2021-08-02

Applicant: Hewlett-Packard Development Company, L.P.

Designer： Vignesh Kannan ,  Joshua M. Yu ,  Matthew David Smith ,  Jeffrey A. Nielsen ,  Kenneth Duda

Abstract: FIG. 1 is perspective view, taken from a front, lower-right elevation of a sensing and dispensing integrated circuit;
FIG. 2 is a front plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
FIG. 3 is a back plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
FIG. 4 is a right side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
FIG. 5 is a left side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
FIG. 6 is a top plan view of the sensing and dispensing integrated circuit shown in FIG. 1; and,
FIG. 7 is a bottom plan view of the sensing and dispensing integrated circuit shown in FIG. 1.
Broken lines shown in the drawings represent portions of the integrated flex circuit that form no part of the claimed design.

公开(公告)号：USD963743S1

公开(公告)日：2022-09-13

申请号：US29728694

申请日：2020-03-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Dennis R. Esterberg ,  Vignesh Kannan ,  Kenneth Joseph Duda