公开(公告)号：US07339532B2

公开(公告)日：2008-03-04

申请号：US11311255

申请日：2005-12-20

申请人： Il Hwan Park ,  Chul Ho Kim ,  Gi Tae Do ,  Duk Woo Lee ,  Jeong Sik Seo ,  Tae Sung Kim ,  Sae Won Oh ,  Hyun Hak Kim

发明人： Il Hwan Park ,  Chul Ho Kim ,  Gi Tae Do ,  Duk Woo Lee ,  Jeong Sik Seo ,  Tae Sung Kim ,  Sae Won Oh ,  Hyun Hak Kim

IPC分类号： H01Q1/24

CPC分类号： H01Q9/0407 ,  H01Q1/242 ,  H01Q1/243 ,  H01Q1/38

摘要： The present invention relates to an antenna module which can minimize the occupying space in an electronic device, enhancing degrees of freedom to increase efficiency in space utilization, thereby accommodating miniaturization and multi-functionality of the electronic device, and an electronic device having the same. The antenna module includes a flexible substrate, an antenna element having a feeder part, a first fixing part, and a radiation part. The antenna module further includes a feeder line connected to the feeder part having a feeder pad, a first fixing pad connected to the first fixing part, and a pad coupling element. In the invention, signals are processed via interaction between the resonance of the current running through the feeder line to the radiation part and the resonance of the current coming into the pad coupling element.

摘要翻译： 本发明涉及一种天线模块，其能够最小化电子设备中的占用空间，提高空间利用效率的自由度，从而适应电子设备的小型化和多功能性，以及具有该天线模块的电子设备。 天线模块包括柔性基板，具有馈电部分的天线元件，第一固定部分和辐射部分。 所述天线模块还包括连接到所述馈电部分的馈电线，所述馈线部分具有馈电焊盘，连接到所述第一固定部分的第一固定焊盘以及焊盘联接元件。 在本发明中，信号通过在通过馈线的电流的谐振与辐射部分之间的相互作用以及进入焊盘耦合元件的电流的谐振之间的相互作用而被处理。

公开(公告)号：US07126547B2

公开(公告)日：2006-10-24

申请号：US10983634

申请日：2004-11-09

申请人： Hyun Hak Kim ,  Chul Ho Kim ,  Jeong Sik Seo ,  II Hwan Park

发明人： Hyun Hak Kim ,  Chul Ho Kim ,  Jeong Sik Seo ,  II Hwan Park

IPC分类号： H01Q1/24

CPC分类号： H01Q1/243 ,  H01Q1/38 ,  H01Q9/0421 ,  H01Q21/0025

摘要： An antenna module, which minimizes a space, in an electronic apparatus set, occupied thereby without changing characteristics thereof, improves a degree of freedom of the installation structure thereof to increase the space utilization of the set, and achieves miniaturization and multi-functionality of electronic apparatuses, and an electronic apparatus having the antenna module. The antenna module includes a PCB (printed circuit board) made of nonconductive material having flexibility; an antenna element mounted at a designated position of the upper surface of the PCB; a ground line formed on the PCB so that the ground line is connected to a ground terminal of the antenna element, and provided with a joint portion formed at one end thereof; a feeder line formed on the PCB so that the feeder line is connected to a signal terminal of the antenna element, and provided with a joint portion formed at one end thereof; and a passive line, having a designated length, formed on the PCB in parallel with the feeder line. The joint portions of the ground line and the feeder line are bonded to designated positions of a set of the wireless electronic apparatus, and a portion of the antenna module having the antenna element mounted on the PCB is located outside the set.

摘要翻译： 在不改变其特性的情况下使电子设备组中的空间最小化的天线模块提高了其安装结构的自由度，从而提高了组件的空间利用率，并实现了电子设备的小型化和多功能化 装置和具有天线模块的电子装置。 天线模块包括由具有柔性的非导电材料制成的PCB（印刷电路板） 安装在PCB的上表面的指定位置的天线元件; 形成在PCB上的接地线，使得接地线连接到天线元件的接地端子，并且在其一端设置有接合部分; 形成在PCB上的馈电线，使得馈线与天线元件的信号端子连接，并且在其一端设置有接合部分; 以及具有指定长度的无源线，其与馈线相平行地形成在PCB上。 接地线和馈电线的接合部分接合到一组无线电子设备的指定位置，并且具有安装在PCB上的天线元件的天线模块的一部分位于组外部。

公开(公告)号：US07498990B2

公开(公告)日：2009-03-03

申请号：US11457393

申请日：2006-07-13

申请人： Il Hwan Park ,  Chul Ho Kim ,  Jong Lae Kim ,  Hyun Hak Kim

发明人： Il Hwan Park ,  Chul Ho Kim ,  Jong Lae Kim ,  Hyun Hak Kim

IPC分类号： H01Q1/24 ,  H01Q1/38

CPC分类号： H01Q1/243 ,  H01Q9/0421 ,  H01Q21/28

摘要： In an internal antenna, a first antenna part is disposed on a side of a mobile telecommunication terminal body having at least first and second peripheral surfaces and sides. The first antenna part processes a signal of a first band. Also, a second antenna part is disposed on one of the peripheral surfaces of the mobile telecommunication body. The second antenna part processes a signal of a second band.

摘要翻译： 在内部天线中，第一天线部件设置在具有至少第一和第二外围表面和侧面的移动通信终端主体的一侧上。 第一天线部分处理第一频带的信号。 此外，第二天线部件设置在移动电信主体的外围表面之一上。 第二天线部分处理第二频带的信号。

公开(公告)号：US07002522B2

公开(公告)日：2006-02-21

申请号：US10893923

申请日：2004-07-20

申请人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

发明人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

摘要： Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

摘要翻译： 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块，在该介质块中形成有导电图案的主天线装置，使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置，而相邻的单元层叠结构彼此连接，形成沿着Y轴的方向具有弯曲线结构的层叠结构，并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构，以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。

公开(公告)号：US06992633B2

公开(公告)日：2006-01-31

申请号：US10859145

申请日：2004-06-03

申请人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Jeong Sik Seo ,  Il Hwan Park

发明人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Jeong Sik Seo ,  Il Hwan Park

IPC分类号： H01Q1/24

CPC分类号： H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/385

摘要： Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.

摘要翻译： 这里公开了一种使用双重耦合馈电的多层芯片天线。 多层芯片天线包括第一馈电辐射元件，第一馈电辐射元件包括在第一馈电电极的一侧连接到馈电线的第一馈电电极，并且在第一馈电电极的另一侧连接到地表面，同时形成在第一平面上 所述第一馈电辐射元件连接到所述第一馈电电极，使得所述第一馈电辐射元件具有空间曲折线结构，第二馈电辐射元件在平行于所述第一馈电电极的第二平面上连接到所述第一馈电电极的一部分 第一平面，使得第二馈电辐射元件具有平面曲折线结构，在平行于第一平面的第三平面上连接到第一馈电电极的一部分的第二馈电电极，与第二馈电电耦合的第一寄生辐射元件 电极，以及电耦合到第二馈电电极的第二寄生辐射元件 并且包括多个寄生图案。

公开(公告)号：US20050259012A1

公开(公告)日：2005-11-24

申请号：US10893923

申请日：2004-07-20

申请人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Seo

发明人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Seo

IPC分类号： H01Q9/42 ,  H01Q20060101 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q5/00 ,  H01Q11/08 ,  H01Q13/08 ,  H01Q21/00 ,  H01Q21/30

CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

摘要： Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

摘要翻译： 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块，在该介质块中形成有导电图案的主天线装置，使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置，而相邻的单元层叠结构彼此连接，形成沿着Y轴的方向具有弯曲线结构的层叠结构，并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构，以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。