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21.
公开(公告)号:US10585148B2
公开(公告)日:2020-03-10
申请号:US15375995
申请日:2016-12-12
Applicant: Infineon Technologies AG
Inventor: Anton Bachleitner Hofmann , Hubert Brueckl , Klemens Pruegl , Wolfgang Raberg , Armin Satz , Dieter Suess , Tobias Wurft
Abstract: An embodiment relates to a magnetic sensor device (500) comprising a magneto-resistive structure (501). The magneto-resistive structure (501) comprises a magnetic free layer (502) configured to spontaneously generate a closed flux magnetization pattern in the free layer (502). The magneto-resistive structure (500) also comprises a magnetic reference layer (506) having a non-closed flux reference magnetization pattern. The magnetic sensor device (500) further comprises a current generator (580) configured to generate an electric current in one or more layers of the magneto-resistive structure (501). The electric current has a non-zero directional component perpendicular to the reference magnetization pattern.
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公开(公告)号:US20140103915A1
公开(公告)日:2014-04-17
申请号:US13653611
申请日:2012-10-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor: Armin Satz
IPC: G01B7/30
CPC classification number: G01R33/091 , G01D5/145 , G01D11/245 , G01P3/487 , G01P3/488 , G01R33/0011 , G01R33/09
Abstract: The present disclosure provides for techniques to improve the sensitivity of magnetic sensor systems. One embodiment of a magnetic sensor system includes a magnetic biasing body comprised of a hard magnetic material and including a recess therein. The recess corresponds to a magnetic flux guidance surface of the magnetic biasing body. The magnetic sensor system also includes a magnetic sensing element arranged in or proximate to the recess. A magnetic flux concentrator, which is made of a soft magnetic material, is disposed in the recess between the magnetic flux guidance surface and the magnetic sensing element. Other techniques are also described.
Abstract translation: 本公开提供了用于提高磁传感器系统的灵敏度的技术。 磁传感器系统的一个实施例包括由硬磁材料构成并在其中包括凹部的磁偏置体。 凹部对应于磁性偏置体的磁通引导面。 磁传感器系统还包括设置在凹部中或靠近凹部的磁感测元件。 由磁性材料制成的磁通集中器设置在磁通引导表面和磁感测元件之间的凹槽中。 还描述了其它技术。
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