公开(公告)号：US10288696B2

公开(公告)日：2019-05-14

申请号：US15352989

申请日：2016-11-16

Applicant: Industrial Technology Research Institute

Inventor： Chih-Chung Chiu ,  Chih-Ming Tzeng ,  Li-Ling Liao ,  Yu-Lin Chao ,  Chih-Ming Shen ,  Ming-Kaan Liang ,  Chun-Kai Liu ,  Ming-Ji Dai

IPC: G01R31/40 ,  G01R31/00 ,  H02P29/68 ,  G01R21/06 ,  H02P27/08

Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.

公开(公告)号：US20180007815A1

公开(公告)日：2018-01-04

申请号：US15705271

申请日：2017-09-15

Applicant: Industrial Technology Research Institute

Inventor： Chun-Kai Liu ,  Yu-Lin Chao

IPC: H05K7/20 ,  H05K1/02 ,  H01L25/07 ,  H05K7/14 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/473 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H05K1/028 ,  H05K7/1432 ,  H05K7/20918

Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.