公开(公告)号：US20240266985A1

公开(公告)日：2024-08-08

申请号：US18307794

申请日：2023-04-26

Applicant: Industrial Technology Research Institute

Inventor： Shian-Chiau Chiou ,  Yu-Hua Cheng ,  Chih-Ming Tzeng

IPC: H02P29/024 ,  H02M7/219 ,  H02M7/5387

CPC classification number: H02P29/027 ,  H02M7/219 ,  H02M7/53875 ,  H02P29/025 ,  H02M5/4585

Abstract: A power integrated module (PIM) and a motor control system are provided. The PIM is adapted to drive a motor. The PIM includes a first transformation circuit, a second transformation circuit, and a plurality of shunt units. The first transformation circuit includes a plurality of first half-bridge circuits, and a coupling relationship among the first half-bridge circuits is selected, so that the first transformation circuit is operated in a rectifier mode or an inverter mode. The second transformation circuit includes a plurality of second half-bridge circuits coupled to the motor. The shunt units are respectively coupled between the second half-bridge circuits and the motor and configured to sense a current between the second transformation circuit and the motor.

公开(公告)号：US10288696B2

公开(公告)日：2019-05-14

申请号：US15352989

申请日：2016-11-16

Applicant: Industrial Technology Research Institute

Inventor： Chih-Chung Chiu ,  Chih-Ming Tzeng ,  Li-Ling Liao ,  Yu-Lin Chao ,  Chih-Ming Shen ,  Ming-Kaan Liang ,  Chun-Kai Liu ,  Ming-Ji Dai

IPC: G01R31/40 ,  G01R31/00 ,  H02P29/68 ,  G01R21/06 ,  H02P27/08

Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.

公开(公告)号：US20240162114A1

公开(公告)日：2024-05-16

申请号：US18166496

申请日：2023-02-09

Applicant: Industrial Technology Research Institute

Inventor： Shian-Chiau Chiou ,  Chun-Kai Liu ,  Po-Kai Chiu ,  Chih-Ming Tzeng ,  Yao-Shun Chen

IPC: H01L23/427 ,  H01L23/498

CPC classification number: H01L23/427 ,  H01L23/49894 ,  H01L24/32

Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

公开(公告)号：US10672677B2

公开(公告)日：2020-06-02

申请号：US15979403

申请日：2018-05-14

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ,  Win-House Electronic Co., Ltd.

Inventor： Jing-Yao Chang ,  Tao-Chih Chang ,  Kuo-Shu Kao ,  Fang-Jun Leu ,  Hsin-Han Lin ,  Chih-Ming Tzeng ,  Hsiao-Ming Chang ,  Chih-Ming Shen

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.