公开(公告)号：US20220199562A1

公开(公告)日：2022-06-23

申请号：US17131663

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Andreas WOLTER ,  Georg SEIDEMANN ,  Thomas WAGNER

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538

Abstract: Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.