公开(公告)号：US20220036500A1

公开(公告)日：2022-02-03

申请号：US17500375

申请日：2021-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US10909652B2

公开(公告)日：2021-02-02

申请号：US16355303

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

公开(公告)号：US10803548B2

公开(公告)日：2020-10-13

申请号：US16355377

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.