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公开(公告)号：US20250104179A1
公开(公告)日：2025-03-27
申请号：US18905803
申请日：2024-10-03
Applicant: Intel Corporation
Inventor： Altug Koker , Lance Cheney , Eric Finley , Varghese George , Sanjeev Jahagirdar , Josh Mastronarde , Naveen Matam , Iqbal Rajwani , Lakshminarayanan Striramassarma , Melaku Teshome , Vikranth Vemulapalli , Binoj Xavier
Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
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公开(公告)号：US20240256456A1
公开(公告)日：2024-08-01
申请号：US18391346
申请日：2023-12-20
Applicant: Intel Corporation
Inventor： Vikranth Vemulapalli , Lakshminarayanan Striramassarma , Mike MacPherson , Aravindh Anantaraman , Ben Ashbaugh , Murali Ramadoss , William B. Sadler , Jonathan Pearce , Scott Janus , Brent Insko , Vasanth Ranganathan , Kamal Sinha , Arthur Hunter, Jr. , Prasoonkumar Surti , Nicolas Galoppo von Borries , Joydeep Ray , Abhishek R. Appu , ElMoustapha Ould-Ahmed-Vall , Altug Koker , Sungye Kim , Subramaniam Maiyuran , Valentin Andrei
IPC: G06F12/0862 , G06T1/20 , G06T1/60
CPC classification number: G06F12/0862 , G06T1/20 , G06T1/60 , G06F2212/602 , G06F2212/608
Abstract: Embodiments are generally directed to data prefetching for graphics data processing. An embodiment of an apparatus includes one or more processors including one or more graphics processing units (GPUs); and a plurality of caches to provide storage for the one or more GPUs, the plurality of caches including at least an L1 cache and an L3 cache, wherein the apparatus to provide intelligent prefetching of data by a prefetcher of a first GPU of the one or more GPUs including measuring a hit rate for the Li cache; upon determining that the hit rate for the L1 cache is equal to or greater than a threshold value, limiting a prefetch of data to storage in the L3 cache, and upon determining that the hit rate for the L1 cache is less than a threshold value, allowing the prefetch of data to the L1 cache.
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公开(公告)号：US20230351543A1
公开(公告)日：2023-11-02
申请号：US18310688
申请日：2023-05-02
Applicant: Intel Corporation
Inventor： Joydeep Ray , Scott Janus , Varghese George , Subramaniam Maiyuran , Altug Koker , Abhishek Appu , Prasoonkumar Surti , Vasanth Ranganathan , Valentin Andrei , Ashutosh Garg , Yoav Harel , Arthur Hunter, JR. , SungYe Kim , Mike Macpherson , Elmoustapha Ould-Ahmed-Vall , William Sadler , Lakshminarayanan Striramassarma , Vikranth Vemulapalli
IPC: G06N3/084 , G06F15/80 , G06F17/16 , G06N3/048 , G06T1/20 , G06F9/50 , G06F12/0806 , G06F7/544 , G06N3/08
CPC classification number: G06T1/20 , G06F7/5443 , G06F9/5027 , G06F12/0806 , G06F15/8046 , G06F17/16 , G06N3/048 , G06N3/08 , G06N3/084
Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to detect zero value elements within a vector or a set of packed data elements output by a processing resource and generate metadata to indicate a location of the zero value elements within the plurality of data elements.
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公开(公告)号：US11676239B2
公开(公告)日：2023-06-13
申请号：US17303654
申请日：2021-06-03
Applicant: Intel Corporation
Inventor： Joydeep Ray , Scott Janus , Varghese George , Subramaniam Maiyuran , Altug Koker , Abhishek Appu , Prasoonkumar Surti , Vasanth Ranganathan , Andrei Valentin , Ashutosh Garg , Yoav Harel , Arthur Hunter, Jr. , SungYe Kim , Mike Macpherson , Elmoustapha Ould-Ahmed-Vall , William Sadler , Lakshminarayanan Striramassarma , Vikranth Vemulapalli
IPC: G06T1/20 , G06F9/50 , G06F12/0806 , G06F15/80 , G06F17/16 , G06F7/544 , G06N3/04 , G06N3/08 , G06N3/084 , G06N3/048
CPC classification number: G06T1/20 , G06F7/5443 , G06F9/5027 , G06F12/0806 , G06F15/8046 , G06F17/16 , G06N3/048 , G06N3/08 , G06N3/084
Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.
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公开(公告)号：US20220261289A1
公开(公告)日：2022-08-18
申请号：US17686089
申请日：2022-03-03
Applicant: Intel Corporation
Inventor： Ben Ashbaugh , Jonathan Pearce , Murali Ramadoss , Vikranth Vemulapalli , William B. Sadler , Sungye Kim , Marian Alin Petre
Abstract: Embodiments are generally directed to thread group scheduling for graphics processing. An embodiment of an apparatus includes a plurality of processors including a plurality of graphics processors to process data; a memory; and one or more caches for storage of data for the plurality of graphics processors, wherein the one or more processors are to schedule a plurality of groups of threads for processing by the plurality of graphics processors, the scheduling of the plurality of groups of threads including the plurality of processors to apply a bias for scheduling the plurality of groups of threads according to a cache locality for the one or more caches.
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Patent Agency Ranking
公开(公告)号：US20220180468A1
公开(公告)日：2022-06-09
申请号：US17674781
申请日：2022-02-17
Applicant: Intel Corporation
Inventor： Naveen Matam , Lance Cheney , Eric Finley , Varghese George , Sanjeev Jahagirdar , Altug Koker , Josh Mastronarde , Iqbal Rajwani , Lakshminarayanan Striramassarma , Melaku Teshome , Vikranth Vemulapalli , Binoj Xavier
Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
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公开(公告)号：US20210255957A1
公开(公告)日：2021-08-19
申请号：US17161465
申请日：2021-01-28
Applicant: Intel Corporation
Inventor： Vikranth Vemulapalli , Lakshminarayanan Striramassarma , Mike MacPherson , Aravindh Anantaraman , Ben Ashbaugh , Murali Ramadoss , William B. Sadler , Jonathan Pearce , Scott Janus , Brent Insko , Vasanth Ranganathan , Kamal Sinha , Arthur Hunter, JR. , Prasoonkumar Surti , Nicolas Galoppo von Borries , Joydeep Ray , Abhishek R. Appu , ElMoustapha Ould-Ahmed-Vall , Altug Koker , Sungye Kim , Subramaniam Maiyuran , Valentin Andrei
IPC: G06F12/0862 , G06T1/20 , G06T1/60
Abstract: Embodiments are generally directed to data prefetching for graphics data processing. An embodiment of an apparatus includes one or more processors including one or more graphics processing units (GPUs); and a plurality of caches to provide storage for the one or more GPUs, the plurality of caches including at least an L1 cache and an L3 cache, wherein the apparatus to provide intelligent prefetching of data by a prefetcher of a first GPU of the one or more GPUs including measuring a hit rate for the L1 cache; upon determining that the hit rate for the L1 cache is equal to or greater than a threshold value, limiting a prefetch of data to storage in the L3 cache, and upon determining that the hit rate for the L1 cache is less than a threshold value, allowing the prefetch of data to the L1 cache.
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公开(公告)号：US20210133913A1
公开(公告)日：2021-05-06
申请号：US17069188
申请日：2020-10-13
Applicant: Intel Corporation
Inventor： Naveen Matam , Lance Cheney , Eric Finley , Varghese George , Sanjeev Jahagirdar , Altug Koker , Josh Mastronarde , Iqbal Rajwani , Lakshminarayanan Striramassarma , Melaku Teshome , Vikranth Vemulapalli , Binoj Xavier
Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
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公开(公告)号：US10417730B2
公开(公告)日：2019-09-17
申请号：US15386111
申请日：2016-12-21
Applicant: Intel Corporation
Inventor： Subramaniam Maiyuran , Jorge F. Garcia Pabon , Vikranth Vemulapalli , Chandra S. Gurram , Aditya Navale , Saurabh Sharma
Abstract: A processing apparatus is described. The apparatus includes a graphics processing unit (GPU), including a register file having a plurality of channels to store data and an execution unit to examine data at each of the plurality of channels, read a data value from a first of the plurality of channels upon a determination that each of the plurality of channels has the same data and execute a single input multi data (SIMD) instruction based on the data value.
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公开(公告)号：US20250061535A1
公开(公告)日：2025-02-20
申请号：US18820907
申请日：2024-08-30
Applicant: Intel Corporation
Inventor： Naveen Matam , Lance Cheney , Eric Finley , Varghese George , Sanjeev Jahagirdar , Altug Koker , Josh Mastronarde , Iqbal Rajwani , Lakshminarayanan Striramassarma , Melaku Teshome , Vikranth Vemulapalli , Binoj Xavier
Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
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