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29 条记录 (耗时 0.03 秒)

    AVOCADO PITTING DEVICE
    21.
    发明申请
    AVOCADO PITTING DEVICE 有权
    AVOCADO定位装置

    公开(公告)号：US20130047865A1

    公开(公告)日：2013-02-28

    申请号：US13215807

    申请日：2011-08-23

    申请人： Mark Prommel ,  Todd Brunner ,  Kevin O'Leary

    发明人： Mark Prommel ,  Todd Brunner ,  Kevin O'Leary

    IPC分类号： A47J25/00

    CPC分类号： A47J23/00

    摘要： An avocado pitting device comprises a housing having an inner surface defining a recess. The recess is configured to receive a pit of an avocado. An engagement member projects inwardly from the housing inner surface. The engagement member is configured to engage the pit and retain the pit within the recess such that the pit is removable with the housing from the avocado.

    摘要翻译： 鳄梨点蚀装置包括具有限定凹部的内表面的壳体。 凹槽配置成接收鳄梨坑。 接合构件从壳体内表面向内突出。 接合构件被配置为接合凹坑并将凹坑保持在凹部内，使得凹坑可以与壳体从鳄梨中移除。

    Method for transferring process control models between plasma processing chambers
    22.
    发明申请
    Method for transferring process control models between plasma processing chambers 有权
    在等离子体处理室之间传送过程控制模型的方法

    公开(公告)号：US20060042753A1

    公开(公告)日：2006-03-02

    申请号：US11157644

    申请日：2005-06-21

    申请人： Kevin O'Leary ,  Francisco Martinez ,  Marcus Carbery

    发明人： Kevin O'Leary ,  Francisco Martinez ,  Marcus Carbery

    IPC分类号： G03C5/00

    CPC分类号： G05B23/0237 ,  H01J37/32082 ,  H01J37/32935

    摘要： A method of transferring a multi-variate process control model from one RF-powered plasma processing chamber (the reference chamber) to another nominally identical RF-powered plasma processing chamber (the target chamber) comprises first determining a multi-variate process control model on the reference tool based upon sensor data, 100. Then, a set of sensor data is taken for the reference chamber by running a designed experiment, 102, and a corresponding set of sensor data is taken for the target chamber using the same designed experiment, 104. The relationship between the reference and target chambers is determined by comparing the results of the designed experiments and calculating a transform matrix representing differences between the two chambers, 106. Finally, the process control model is transformed from the reference chamber to the target chamber using the transform matrix thus obtained, 108.

    摘要翻译： 将多变量过程控制模型从一个RF供电的等离子体处理室（参考室）转移到另一个名义上相同的RF供电的等离子体处理室（目标室）的方法包括首先确定多变量过程控制模型 基于传感器数据的参考工具100.然后，通过运行设计的实验102获取用于参考室的一组传感器数据，并且使用相同的设计实验为目标室获取相应的一组传感器数据， 参考和目标室之间的关系通过比较设计实验的结果和计算表示两个室之间差异的变换矩阵来确定。最后，过程控制模型从参考室转变为目标室 使用由此获得的变换矩阵，108。

    Plasma chamber conditioning
    23.
    发明授权
    Plasma chamber conditioning 有权
    等离子室调节

    公开(公告)号：US06656848B1

    公开(公告)日：2003-12-02

    申请号：US10133931

    申请日：2002-04-26

    申请人： John Scanlan ,  Kevin O'Leary ,  Barry Coonan

    发明人： John Scanlan ,  Kevin O'Leary ,  Barry Coonan

    IPC分类号： H01L21302

    CPC分类号： H01J37/32009 ,  H01J37/32862 ,  H01L21/67069 ,  H01L21/67253

    摘要： A method for determining the optimum number of conditioning wafers to be run following a wet clean of the walls of an RF plasma chamber 1 is based on an electrical precursor signal. Polymer build up on a plasma chamber wall during normal chamber conditioning is monitored by observing components of the fundamental RF signal. After a pre-determined number of wafers has been run, a predictive model is used to determine the total number of wafers needed to complete the conditioning cycle.

    摘要翻译： 用于确定在RF等离子体室1的壁的湿清洁之后待运行的调理晶片的最佳数量的方法基于电前驱体信号。 通过观察基本RF信号的分量来监测正常室调节期间在等离子体室壁上积聚的聚合物。 在预定数量的晶片已经运行之后，使用预测模型来确定完成调节周期所需的晶片总数。

    Method for process control of semiconductor manufacturing equipment
    28.
    发明授权
    Method for process control of semiconductor manufacturing equipment 有权
    半导体制造设备的过程控制方法

    公开(公告)号：US07062411B2

    公开(公告)日：2006-06-13

    申请号：US10791132

    申请日：2004-03-02

    申请人： Michael Hopkins ,  John Scanlan ,  Kevin O'Leary ,  Marcus Carbery

    发明人： Michael Hopkins ,  John Scanlan ,  Kevin O'Leary ,  Marcus Carbery

    IPC分类号： G06F15/00

    CPC分类号： H01L21/67288 ,  C23C16/52 ,  H01L21/67276

    摘要： A method of fault identification on a semiconductor manufacturing tool includes monitoring tool sensor output, establishing a fingerprint of tool states based on the plurality of sensors outputs, capturing sensor data indicative of fault conditions, building a library of such fault fingerprints, comparing present tool fingerprint with fault fingerprints to identify a fault condition and estimating the effect of such a fault condition on process output. The fault library is constructed by inducing faults in a systematic way or by adding fingerprints of known faults after they occur.

    摘要翻译： 半导体制造工具的故障识别方法包括监测工具传感器输出，基于多个传感器输出建立工具状态指纹，捕获指示故障状况的传感器数据，构建这种故障指纹库，比较当前工具指纹 具有故障指纹以识别故障状况并估计这种故障状态对过程输出的影响。 故障库是通过系统方式引发故障或通过在已知故障发生后添加指纹来构建的。