公开(公告)号：US20150125065A1

公开(公告)日：2015-05-07

申请号：US14506407

申请日：2014-10-03

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Lisheng Gao ,  Jan Lauber ,  Yong Zhang

IPC: G06T7/00 ,  G06T5/00

CPC classification number: G06T7/001 ,  G06T5/00 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28

Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.

Abstract translation: 光学图像与SEM图像的相关性包括通过用光学检查子系统扫描样本来获取样品的全部光学图像，存储全部光学图像，识别存在于全光学中的感兴趣特征的位置 具有附加源的图像，使用SEM工具获取包括所述特征的所述特征的一部分的SEM图像，获取由所述附加源识别的位置处的光学图像部分，所述图像部分包括参考结构 ，基于图像部分和SEM图像两者中感兴趣特征和参考结构的存在，将图像部分和SEM图像相关联，并将感兴趣特征的位置转移到SEM图像中 全光学图像的图像部分的坐标系，以形成校正的光学图像。

公开(公告)号：US20130188859A1

公开(公告)日：2013-07-25

申请号：US13742259

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Tao Luo ,  Yong Zhang ,  Stephanie Chen

IPC: G06T7/00

CPC classification number: G06T7/0002 ,  G06T7/0004 ,  G06T7/13 ,  G06T7/143 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

Abstract translation: 提供了用于分割用于晶片检查的像素的方法和系统。 一种方法包括基于由检查系统为晶片获取的图像中的各个像素的特性来确定各个像素的统计量。 该方法还包括基于统计量将各个像素分配给第一段。 此外，该方法包括检测第一段的图像中的第一段之间的一个或多个边缘，并且通过将一个或多个边缘跨越与晶片的图像对应的区域来生成边缘图。 该方法还包括通过将第一段和边缘图应用于晶片的图像来将各个像素分配给第二段，从而分割图像。 基于分配了各个像素的第二段执行缺陷检测。