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    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER
    1.
    发明申请
    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER 审中-公开

    公开(公告)号：US20180202943A1

    公开(公告)日：2018-07-19

    申请号：US15865130

    申请日：2018-01-08

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Optical Die to Database Inspection
    3.
    发明申请
    Optical Die to Database Inspection 有权

    公开(公告)号：US20170191948A1

    公开(公告)日：2017-07-06

    申请号：US15391753

    申请日：2016-12-27

    Applicant: KLA-Tencor Corporation

    Inventor： Lisheng Gao ,  Tao Luo ,  Keith Wells ,  Xiaochun Li

    IPC: G01N21/956 ,  G06T7/00 ,  G01N21/95

    CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2201/12 ,  G06T7/001 ,  G06T2207/20084 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

    Systems and methods for detecting defects on a wafer
    4.
    发明授权
    Systems and methods for detecting defects on a wafer 有权

    公开(公告)号：US10605744B2

    公开(公告)日：2020-03-31

    申请号：US15865130

    申请日：2018-01-08

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Systems and Methods for Detecting Defects on a Wafer
    6.
    发明申请
    Systems and Methods for Detecting Defects on a Wafer 有权
    用于检测晶片缺陷的系统和方法

    公开(公告)号：US20130250287A1

    公开(公告)日：2013-09-26

    申请号：US13900465

    申请日：2013-05-22

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

    Wafer Inspection Using Free-Form Care Areas
    8.
    发明申请
    Wafer Inspection Using Free-Form Care Areas 有权
    使用自由形式护理区域的晶圆检查

    公开(公告)号：US20140376802A1

    公开(公告)日：2014-12-25

    申请号：US14168011

    申请日：2014-01-30

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Kenong Wu ,  Tao Luo ,  Lisheng Gao ,  Eugene Shifrin ,  Aravindh Balaji

    IPC: G06T7/00

    CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于晶片图案确定晶片护理区域的特征。 确定特征包括确定护理区域的位置，为每个护理区域确定晶片图案中的至少一种感兴趣模式（POI），允许任何护理区域具有自由形状，允许护理区域 大于框架图像并且为至少一个护理区域选择两个或更多个POI。 该方法还包括使用检查系统搜索为晶片生成的图像中的POI。 此外，该方法包括通过确定图像中的护理区域的位置并基于图像中的护理区域的位置将一个或多个缺陷检测方法应用于图像来检测晶片上的缺陷。

    Segmentation for wafer inspection
    9.
    发明授权
    Segmentation for wafer inspection 有权
    晶圆检测分段

    公开(公告)号：US08831334B2

    公开(公告)日：2014-09-09

    申请号：US13742259

    申请日：2013-01-15

    Applicant: KLA-Tencor Corporation

    Inventor： Tao Luo ,  Yong Zhang ,  Stephanie Chen

    IPC: G06T7/00

    CPC classification number: G06T7/0002 ,  G06T7/0004 ,  G06T7/13 ,  G06T7/143 ,  G06T2207/20076 ,  G06T2207/30148

    Abstract: Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

    Abstract translation: 提供了用于分割用于晶片检查的像素的方法和系统。 一种方法包括基于由检查系统为晶片获取的图像中的各个像素的特性来确定各个像素的统计量。 该方法还包括基于统计量将各个像素分配给第一段。 此外，该方法包括检测第一段的图像中的第一段之间的一个或多个边缘，并且通过将一个或多个边缘跨越与晶片的图像对应的区域来生成边缘图。 该方法还包括通过将第一段和边缘图应用于晶片的图像来将各个像素分配给第二段，从而分割图像。 基于分配了各个像素的第二段执行缺陷检测。

    Optical die to database inspection
    10.
    发明授权
    Optical die to database inspection 有权

    公开(公告)号：US09915625B2

    公开(公告)日：2018-03-13

    申请号：US15391753

    申请日：2016-12-27

    Applicant: KLA-Tencor Corporation

    Inventor： Lisheng Gao ,  Tao Luo ,  Keith Wells ,  Xiaochun Li

    IPC: G01N21/95 ,  G01N21/956 ,  G06T7/00

    CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2201/12 ,  G06T7/001 ,  G06T2207/20084 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

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