Abstract:
What are disclosed are a non-toxic stabilizer mixture for a molding compound comprising a halogenated polymer, said stabilizer mixture comprising about 40 percent by weight of a didodecyltin-bis-thioglycolic acid ester of the formula(n-C.sub.12 H.sub.25).sub.2 Sn(SCH.sub.2 COOR).sub.2and about 60 percent by weight of a dodecyltin-tristhioglycolic acid ester of the formulan-C.sub.12 H.sub.25 Sn(SCH.sub.2 COOR).sub.3wherein R is a straight-chain or branched-chain alkyl having 8 to 20 carbon atoms, a method for stabilizing a halogenated molding compound with such a stabilizer mixture, and a stabilized molding compound comprising such a stabilizer mixture.
Abstract:
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.
Abstract:
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.
Abstract:
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.
Abstract:
A system for dividing a workspace includes first and second vertically extending walls having a respective upper and lower edge and respective side edges. The first and second walls are arranged in parallel to partially enclose an area. A ceiling is included that extends between the first and second walls to join the upper edges of the first and second walls and at least partially cover the partially enclosed area. The resulting arch-shaped divider system may include any of a plurality of features. For example, the systems may include integrated work surfaces, informational areas, or may include viewing passages and may be arranged in a variety of configurations designed to facilitate collaborative work.
Abstract:
A semiconductor circuit arrangement includes a circuit element embedded in a semiconductor substrate of a first conductivity type in an integrated manner and is provided with at least one gate electrode and first and second terminal electrodes. The first terminal electrode includes a well region that is embedded in the semiconductor substrate and is of a second conductivity type which is opposite the first conductivity type. A sub-well region is embedded in the well region of the first terminal electrode and is of the second conductivity type and has a higher doping than said well region. The sub-well region is embedded in the surface of the substrate and ends without reaching a well region of the gate electrode which is of the first conductivity type.