公开(公告)号：US20210243897A1

公开(公告)日：2021-08-05

申请号：US17163648

申请日：2021-02-01

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter A. Blais ,  Robert Andrew Ramsbottom ,  Jeffrey Poltorak ,  Courtney Elliott

IPC: H05K1/18 ,  H01G9/045 ,  H05K1/03 ,  H05K3/30 ,  H05K3/46

Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

公开(公告)号：US20210057167A1

公开(公告)日：2021-02-25

申请号：US17089875

申请日：2020-11-05

Applicant: KEMET Electronics Corporation

Inventor： Antony Chacko ,  Randolph S. Hahn ,  David Jacobs ,  Brandon Summey

IPC: H01G9/10 ,  H01G9/00 ,  H01G9/15 ,  H01G9/04 ,  H01G9/042

Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

公开(公告)号：US20170178818A1

公开(公告)日：2017-06-22

申请号：US15443787

申请日：2017-02-27

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Yanming Liu

IPC: H01G4/38 ,  H01G4/008

CPC classification number: H01G4/38 ,  H01G4/005 ,  H01G4/008 ,  H01G9/0029 ,  H01G9/055 ,  Y10T29/302 ,  Y10T29/43

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

公开(公告)号：US20130250486A1

公开(公告)日：2013-09-26

申请号：US13894679

申请日：2013-05-15

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak ,  Philip M. Lessner ,  Yongjian Qiu ,  Randolph S. Hahn ,  David Jacobs ,  Keith R. Brenneman ,  Albert K. Harrington ,  Chris Stolarski

IPC: H01G9/15 ,  H01G9/00

CPC classification number: H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  H01G9/048 ,  Y10T29/41 ,  Y10T29/417 ,  Y10T29/43

Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

Abstract translation: 描述了改进的固体电解电容器和形成固体电解电容器的方法。 该方法包括形成包括阀金属或阀金属的导电氧化物的阳极，其中阳极引线延伸部从阳极伸出。 在阳极上形成电介质，在电介质上形成阴极层。 阳极，电介质和阴极层被封装在非导电材料中，并且阳极引线延伸部暴露在外壳的外侧的侧表面处。 导电金属层粘附到阳极引线延伸部，其优选地通过将预制的固体金属端子，最优选地L形端子电连接到侧表面处的导电金属层来终止。