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    Solid Electrolytic Capacitor and Method
    2.
    发明申请
    Solid Electrolytic Capacitor and Method 有权
    固体电解电容器及方法

    公开(公告)号：US20140211371A1

    公开(公告)日：2014-07-31

    申请号：US14162268

    申请日：2014-01-23

    申请人： Kemet Electronics Corporation

    发明人： Brandon Summey ,  Jeffrey Poltorak

    IPC分类号： H01G9/048 ,  H01G9/00

    CPC分类号： H01G9/012 ,  H01G9/10 ,  H01G9/15 ,  Y10T29/435

    摘要： An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.

    摘要翻译： 提供了一种改进的电容器，其具有至少一个在阳极上具有电介质的阳极和从阳极延伸的阳极引线。 导电阴极层位于电介质上。 阳极引线框架电连接到阳极，阴极引线框架电连接到阴极。 密封剂封装阳极，阳极引线框架的一部分和阴极引线框架的一部分，使得阳极引线框架从密封剂延伸以形成外部阳极引线框架，并且阴极引线框架从密封剂延伸以形成外部阴极引线框架。 提供至少一个次级电连接，其中次级电连接与阴极电接触并且延伸通过密封剂到外部阴极引线框架，或者次级电触点与阳极电接触并延伸穿过密封剂到外部 阳极引线框架

    Solid electrolytic capacitor and method of manufacture
    7.
    发明授权
    Solid electrolytic capacitor and method of manufacture 有权
    固体电解电容器及其制造方法

    公开(公告)号：US09053866B2

    公开(公告)日：2015-06-09

    申请号：US13894679

    申请日：2013-05-15

    申请人： Kemet Electronics Corporation

    发明人： Brandon Summey ,  Jeffrey Poltorak ,  Philip M. Lessner ,  Yongjian Qiu ,  Randolph S. Hahn ,  David Jacobs ,  Keith R. Brenneman ,  Albert K. Harrington ,  Chris Stolarski

    IPC分类号： H01G9/042 ,  H01G9/15 ,  H01G9/00 ,  H01G9/012 ,  H01G9/048

    CPC分类号： H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  H01G9/048 ,  Y10T29/41 ,  Y10T29/417 ,  Y10T29/43

    摘要： An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

    摘要翻译： 描述了改进的固体电解电容器和形成固体电解电容器的方法。 该方法包括形成包括阀金属或阀金属的导电氧化物的阳极，其中阳极引线延伸部从阳极伸出。 在阳极上形成电介质，在电介质上形成阴极层。 阳极，电介质和阴极层被封装在非导电材料中，并且阳极引线延伸部暴露在外壳的外侧的侧表面处。 导电金属层粘附到阳极引线延伸部，其优选地通过将预制的固体金属端子，最优选地L形端子电连接到侧表面处的导电金属层来终止。

    Solid electrolytic capacitor and method of manufacturing a solid electrolytic capacitor
    9.
    发明授权
    Solid electrolytic capacitor and method of manufacturing a solid electrolytic capacitor 有权
    固体电解电容器及固体电解电容器的制造方法

    公开(公告)号：US09583273B2

    公开(公告)日：2017-02-28

    申请号：US14184057

    申请日：2014-02-19

    申请人： KEMET Electronics Corporation

    发明人： Jeffrey Poltorak ,  Brandon Summey ,  Antony P. Chacko

    IPC分类号： H01G9/028 ,  H01G9/042 ,  H01G9/00 ,  H01G9/048 ,  H01G9/15 ,  C25D13/12

    CPC分类号： H01G9/0425 ,  C25D13/12 ,  H01G9/0029 ,  H01G9/028 ,  H01G9/048 ,  H01G9/15 ,  Y10T29/417

    摘要： Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; plating a metal layer on said conductive polymer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.

    摘要翻译： 提供一种形成电容器的方法。 该方法包括：在其上提供电介质和与阳极电接触的导电节点; 在电介质上施加导电种子层; 在导电种子层和导电节点之间形成导电桥; 向阳极施加电压; 由此在导电种子层上形成单体的导电聚合物; 在所述导电聚合物上镀覆金属层; 并破坏导电种子层和导电节点之间的导电桥。