公开(公告)号：US20120104886A1

公开(公告)日：2012-05-03

申请号：US13379118

申请日：2010-06-23

申请人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

发明人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

IPC分类号： H02K5/22 ,  H02K11/00

CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03

摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module is arranged along the heat receiving surface of the heat sink. A control circuit substrate includes a control circuit for controlling driving of a motor and is electrically connected to the power module. A power circuit substrate is supplied with currents supplied to winding wires, and is electrically connected to the power module. In the drive apparatus, the motor case, the control circuit substrate, the power module and the power wiring part are arranged in this order in an axial direction. The power module is arranged longitudinally relative to the end surface wall in the axial direction of the motor case.

摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块沿着散热器的受热表面布置。 控制电路基板包括用于控制电动机的驱动并与电源模块电连接的控制电路。 向电源电路基板供给提供给绕组线的电流，并且电连接到电源模块。 在驱动装置中，马达壳体，控制电路基板，功率模块和电力布线部分沿轴向依次布置。 功率模块相对于电动机壳体的轴向方向上的端面壁纵向布置。

公开(公告)号：US20110018374A1

公开(公告)日：2011-01-27

申请号：US12822627

申请日：2010-06-24

申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

IPC分类号： H02K5/22 ,  H02K11/00 ,  H02K23/66

CPC分类号： H02K9/22 ,  H01L23/36 ,  H01L25/11 ,  H01L2924/0002 ,  H02K11/33 ,  H01L2924/00

摘要： An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.

摘要翻译： 包括半导体模块和电容器的电子电路位于电机的轴向。 每个半导体模块纵向定位成与散热器接触。 更具体地，垂直于包括在半导体模块中的半导体芯片的表面的线垂直于电动机的轴线。 因此，每个电容器被定位成使得电动机在电动机轴向上的位置范围的至少一部分与半导体模块和散热器在轴向方向上的位置范围一致。

公开(公告)号：US20100327709A1

公开(公告)日：2010-12-30

申请号：US12822403

申请日：2010-06-24

申请人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

发明人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

IPC分类号： H02K5/22 ,  H02K11/00 ,  H05K1/02

CPC分类号： H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

公开(公告)号：US20100327679A1

公开(公告)日：2010-12-30

申请号：US12822614

申请日：2010-06-24

申请人： Toshihiro Fujita ,  Hiroyasu Kidokoro ,  Atsushi Furumoto ,  Hideki Kabune ,  Hideki Minato

发明人： Toshihiro Fujita ,  Hiroyasu Kidokoro ,  Atsushi Furumoto ,  Hideki Kabune ,  Hideki Minato

IPC分类号： H02K11/00

CPC分类号： H02K3/522 ,  B62D5/0406 ,  H01L25/115 ,  H01L2924/0002 ,  H02K11/33 ,  H01L2924/00

摘要： A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.

摘要翻译： 马达壳体形成为管状。 半导体模块包括开关元件的半导体芯片，树脂部件和线圈端子。 树脂部件将半导体芯片嵌入其中。 线圈端子从树脂部分突出并直接连接到线圈。 线圈端子和线圈之间的连接部分布置在位于电动机的轴向上彼此面对的树脂部分的顶壁表面和底壁表面之间的位置处。

公开(公告)号：US20100327677A1

公开(公告)日：2010-12-30

申请号：US12822381

申请日：2010-06-24

申请人： Ayako IWAI ,  Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto ,  Yoshimasa Kinpara

发明人： Ayako IWAI ,  Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto ,  Yoshimasa Kinpara

IPC分类号： H02K9/22 ,  H02K11/00

CPC分类号： H01L23/3107 ,  H01L25/11 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/19041 ,  H02K3/522 ,  H02K11/024 ,  H02K11/05 ,  H02K11/33 ,  H02K2203/03 ,  H02K2203/09 ,  H02K2211/03 ,  H01L2924/00

摘要： A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.

摘要翻译： 特殊的端子可以从半导体模块的封装体突出，并且可以与电动机壳体的接合部分接合，以限制半导体模块相对于电机壳体的位置偏移。 附加地或替代地，模块侧接合部分可以形成在封装主体中并且可以与壳体侧接合部分接合以相对于电动机壳体定位半导体模块。