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公开(公告)号：US08683025B2
公开(公告)日：2014-03-25
申请号：US12176712
申请日：2008-07-21
申请人： Hideki Minato
发明人： Hideki Minato
IPC分类号： G06F15/173
CPC分类号： G06F3/0653 , G06F3/0605 , G06F3/0632 , G06F3/067 , G06F11/349
摘要： A host server of a storage system transmits path information and a simultaneous command issue number to a storage managing server, while the path information corresponds to such paths that when the host server executes an application program, the host server accesses to a logical volume, the simultaneous command issue number corresponds to a total number of commands issued to the respective paths. A storage monitoring agent server transmits to the storage managing server, an upper limit number of command multiplex numbers. When accepting path information, a simultaneous command issue number, and the command multiplex number upper limit value, the storage managing server proportionally distributes the command multiplex number upper limit value of the port to the respective paths so as to calculate a command multiplex upper limit value, and calculated result.
摘要翻译： 存储系统的主机服务器向存储管理服务器发送路径信息和同时命令发布号码，而路径信息对应于当主机服务器执行应用程序时主机服务器访问逻辑卷的路径， 同时命令发布号对应于发出到各个路径的命令的总数。 存储监视代理服务器向存储管理服务器发送命令多路复用数字的上限数量。 当接收路径信息，同时命令发布号和命令复用数上限值时，存储管理服务器按比例将端口的命令复用数上限值分配给各个路径，以便计算出命令复用上限值 ，计算结果。
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2.发明授权Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same 有权连接半导体模块单元和使用其的电子电路集成电机器件公开(公告)号：US08630095B2
公开(公告)日：2014-01-14
申请号：US12822412
申请日：2010-06-24
申请人： Hideki Minato , Hideki Kabune , Atsushi Furumoto
发明人： Hideki Minato , Hideki Kabune , Atsushi Furumoto
IPC分类号： H05K5/00
CPC分类号： H02K11/0094 , H01L21/561 , H01L23/3107 , H01L23/49541 , H01L24/37 , H01L24/41 , H01L24/48 , H01L25/072 , H01L2224/0603 , H01L2224/37147 , H01L2224/4103 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H02K3/522 , H02K9/22 , H02K11/024 , H02K11/05 , H02K11/33 , H02K2211/03 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/84
摘要： A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
摘要翻译： 连接的半导体模块单元通过嵌入在树脂部分中的第一母线和第二母线来连接多个半导体模块。 连接的半导体模块单元设置在除了印刷电路板之外的位置。 通过将汇流条与半导体芯片和焊盘一起模制以形成树脂部件，可以容易地实现半导体模块连接结构。
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公开(公告)号：US08310121B2
公开(公告)日：2012-11-13
申请号：US12822614
申请日：2010-06-24
IPC分类号： H02K11/00
CPC分类号： H02K3/522 , B62D5/0406 , H01L25/115 , H01L2924/0002 , H02K11/33 , H01L2924/00
摘要： A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.
摘要翻译： 马达壳体形成为管状。 半导体模块包括开关元件的半导体芯片，树脂部件和线圈端子。 树脂部件将半导体芯片嵌入其中。 线圈端子从树脂部分突出并直接连接到线圈。 线圈端子和线圈之间的连接部分布置在位于电动机的轴向上彼此面对的树脂部分的顶壁表面和底壁表面之间的位置处。
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4.发明申请MANAGEMENT COMPUTER, COMPUTER SYSTEM AND METHOD FOR MONITORING PERFORMANCE OF A STORAGE SYSTEM 失效管理计算机，计算机系统和监控存储系统性能的方法公开(公告)号：US20090150542A1
公开(公告)日：2009-06-11
申请号：US12025248
申请日：2008-02-04
申请人： Satomi YAHIRO , Hideo OHATA , Hideki MINATO
发明人： Satomi YAHIRO , Hideo OHATA , Hideki MINATO
IPC分类号： G06F15/173
CPC分类号： G06F11/3485 , G06F11/3495
摘要： To solve a problem in that reliable detection of a performance problem caused by a configuration change needs detailed performance information, which is costly to keep and analyze, a management computer which manages a computer system having a host computer and a storage system is provided. The management computer is configured to: store performance information obtained from resources that belong to paths at first time intervals until a predetermined length of time elapses since the detection of an addition or removal of the resources to the paths; store performance information obtained from the resources that belong to the paths at second time intervals, which are longer than the first time intervals, without storing performance information obtained from the resources that belong to the paths at the first time intervals after the predetermined length of time elapses since the detection of the addition or removal of the resources to the paths.
摘要翻译： 为了解决由配置变更引起的性能问题的可靠检测的问题，需要提供管理具有主计算机和存储系统的计算机系统的管理计算机的详细性能信息，维护和分析成本高昂。 管理计算机被配置为：从检测到路径的资源的添加或移除以来，存储从第一时间间隔的属于路径的资源获得的性能信息，直到经过预定时间长度; 以比第一时间间隔长的第二时间间隔存储从属于路径的资源获得的性能信息，而不存储在预定时间长度之后的第一时间间隔从属于路径的资源获得的性能信息 自从检测到向路径中添加或删除资源以来经过。
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5.发明申请LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR VEHICLE DEVICE USING SAME 有权连接半导体模块单元和电子电路集成电动机装置公开(公告)号：US20100328901A1
公开(公告)日：2010-12-30
申请号：US12822412
申请日：2010-06-24
申请人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto
发明人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto
CPC分类号： H02K11/0094 , H01L21/561 , H01L23/3107 , H01L23/49541 , H01L24/37 , H01L24/41 , H01L24/48 , H01L25/072 , H01L2224/0603 , H01L2224/37147 , H01L2224/4103 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H02K3/522 , H02K9/22 , H02K11/024 , H02K11/05 , H02K11/33 , H02K2211/03 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/84
摘要： A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
摘要翻译： 连接的半导体模块单元通过嵌入在树脂部分中的第一母线和第二母线来连接多个半导体模块。 连接的半导体模块单元设置在印刷电路板以外的位置。 通过将汇流条与半导体芯片和焊盘一起模制以形成树脂部件，可以容易地实现半导体模块连接结构。
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6.发明授权Semiconductor module and electronic circuit-integrated motor device using same 有权半导体模块和电子电路集成电机器件使用相同公开(公告)号：US08247937B2
公开(公告)日：2012-08-21
申请号：US12822403
申请日：2010-06-24
申请人： Hideki Minato , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
发明人： Hideki Minato , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
CPC分类号： H05K1/18 , H01L2224/73221 , H01L2924/0002 , H02K11/33 , H02K2211/03 , H02M7/003 , H05K2201/1003 , H05K2201/1053 , H05K2201/10659 , H01L2924/00
摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。
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7.发明授权Management system selectively monitoring and storing additional performance data only when detecting addition or removal of resources 失效管理系统仅在检测到资源的添加或删除时才选择性地监视和存储附加的性能数据公开(公告)号：US07653725B2
公开(公告)日：2010-01-26
申请号：US12025248
申请日：2008-02-04
申请人： Satomi Yahiro , Hideo Ohata , Hideki Minato
发明人： Satomi Yahiro , Hideo Ohata , Hideki Minato
IPC分类号： G06F15/173
CPC分类号： G06F11/3485 , G06F11/3495
摘要： To solve a problem in that reliable detection of a performance problem caused by a configuration change needs detailed performance information, which is costly to keep and analyze, a management computer which manages a computer system having a host computer and a storage system is provided. The management computer is configured to: store performance information obtained from resources that belong to paths at first time intervals until a predetermined length of time elapses since the detection of an addition or removal of the resources to the paths; store performance information obtained from the resources that belong to the paths at second time intervals, which are longer than the first time intervals, without storing performance information obtained from the resources that belong to the paths at the first time intervals after the predetermined length of time elapses since the detection of the addition or removal of the resources to the paths.
摘要翻译： 为了解决由配置变更引起的性能问题的可靠检测的问题，需要提供管理具有主计算机和存储系统的计算机系统的管理计算机的详细性能信息，维护和分析成本高昂。 管理计算机被配置为：从检测到路径的资源的添加或移除以来，存储从第一时间间隔的属于路径的资源获得的性能信息，直到经过预定时间长度; 以比第一时间间隔长的第二时间间隔存储从属于路径的资源获得的性能信息，而不存储在预定时间长度之后的第一时间间隔从属于路径的资源获得的性能信息 自从检测到向路径中添加或删除资源以来经过。
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公开(公告)号：US08436500B2
公开(公告)日：2013-05-07
申请号：US13087658
申请日：2011-04-15
申请人： Hideki Minato
发明人： Hideki Minato
IPC分类号： H02K11/00
CPC分类号： H02M7/003 , H01L2924/0002 , H02K11/33 , H01L2924/00
摘要： In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
摘要翻译： 在具有用于驱动电动设备的电动机的两个逆变器电路系统的功率模块中，将安装有功率晶体管和分流电阻的布线板嵌入板状模具部分中。 多个平台具有从模具部分露出的辐射表面。 由第一组焊盘构成的第一焊盘列的辐射表面设置在相同的平面上并且具有相同的直线，并且由第二组焊盘构成的第二焊盘行的辐射表面设置在其上 飞机和直线相同。 第一和第二陆地列的辐射表面通过绝缘辐射片与散热器表面到表面接触，以散发由功率模块产生的热量。
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公开(公告)号：US20110254411A1
公开(公告)日：2011-10-20
申请号：US13087658
申请日：2011-04-15
申请人： Hideki MINATO
发明人： Hideki MINATO
CPC分类号： H02M7/003 , H01L2924/0002 , H02K11/33 , H01L2924/00
摘要： In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
摘要翻译： 在具有用于驱动电动设备的电动机的两个逆变器电路系统的功率模块中，将安装有功率晶体管和分流电阻的布线板嵌入板状模具部分中。 多个平台具有从模具部分露出的辐射表面。 由第一组焊盘构成的第一焊盘列的辐射表面设置在相同的平面上并且具有相同的直线，并且由第二组焊盘构成的第二焊盘行的辐射表面设置在其上 飞机和直线相同。 第一和第二陆地列的辐射表面通过绝缘辐射片与散热器表面到表面接触，以散发由功率模块产生的热量。
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10.发明申请SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权使用相同的半导体模块和电子电路集成电动机公开(公告)号：US20100327709A1
公开(公告)日：2010-12-30
申请号：US12822403
申请日：2010-06-24
申请人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
发明人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
CPC分类号： H05K1/18 , H01L2224/73221 , H01L2924/0002 , H02K11/33 , H02K2211/03 , H02M7/003 , H05K2201/1003 , H05K2201/1053 , H05K2201/10659 , H01L2924/00
摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。
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