Method of manufacturing magnetic recording medium
    24.
    发明授权
    Method of manufacturing magnetic recording medium 失效
    磁记录介质的制造方法

    公开(公告)号:US5954927A

    公开(公告)日:1999-09-21

    申请号:US917112

    申请日:1997-08-25

    CPC分类号: G11B5/7325 G11B5/66 G11B5/851

    摘要: A method of manufacturing a magnetic recording medium by using an in-line sputtering apparatus to successively form, on a substrate, at least one underlying layer, a first magnetic CoPt-based film, a nonmagnetic intermediate film, and a second magnetic CoPt-based film. The underlying film and/or the nonmagnetic film, which are in contact with the first magnetic film, are deposited at a low sputtering power between 100 and 1000 watts to improve the magnetic properties of the magnetic recording medium. Low power sputtering is also effective to improve the distribution of difference of the crystal lattice spacings between the nonmagnetic intermediate film and the first magnetic film and between the underlying layer and the first magnetic film.

    摘要翻译: 一种使用在线溅射装置制造磁记录介质的方法,在衬底上依次形成至少一个下层,第一磁性CoPt基膜,非磁性中间膜和第二磁性CoPt基 电影。 与第一磁性膜接触的下面的薄膜和/或非磁性薄膜以低至1000瓦特的低溅射功率沉积,以提高磁记录介质的磁特性。 低功率溅射对于改善非磁性中间膜和第一磁性膜之间以及下层和第一磁性膜之间的晶格间距的差异的分布也是有效的。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    25.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号:US20090215247A1

    公开(公告)日:2009-08-27

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在扫描装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Light illumination during wafer dicing to prevent aluminum corrosion
    26.
    发明授权
    Light illumination during wafer dicing to prevent aluminum corrosion 有权
    晶圆切割时的光照,防止铝腐蚀

    公开(公告)号:US07998793B2

    公开(公告)日:2011-08-16

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/00

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Manufacturing Method of Semiconductor Device
    27.
    发明申请
    Manufacturing Method of Semiconductor Device 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20080138962A1

    公开(公告)日:2008-06-12

    申请号:US11632993

    申请日:2004-07-22

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 通过照明装置(7a)和(7b)的晶片。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Containment vessel and nuclear power plant

    公开(公告)号:US09818495B2

    公开(公告)日:2017-11-14

    申请号:US13988966

    申请日:2011-09-14

    申请人: Takashi Sato

    发明人: Takashi Sato

    摘要: A containment vessel has an inner shell covering a reactor pressure vessel and an outer shell forming an outer well which is a gas-tight space covering the horizontal outer periphery of the inner shell. The inner shell has a first cylindrical side wall surrounding the horizontal periphery of the reactor pressure vessel, a containment vessel head which covers the upper part of the reactor pressure vessel, and a first top slab connecting in a gas-tight manner the periphery of the containment vessel head and the upper end of the first cylindrical side wall. The outer shell has a second cylindrical side wall surrounding the outer periphery of the first cylindrical side wall, and also has a second to slab connecting in a gas-tight manner the vicinity of the upper end of the second cylindrical side wall and the first cylindrical side wall.

    Power supply circuit and apparatus including the circuit

    公开(公告)号:US09653994B2

    公开(公告)日:2017-05-16

    申请号:US13215035

    申请日:2011-08-22

    IPC分类号: G01R31/00 H02M3/158 H02M1/36

    CPC分类号: H02M3/158 H02M1/36

    摘要: A power supply device supplying power to a device via a power line is provided, where the power supply device includes a first voltage generation unit configured to generate and supply a first direct voltage to the power line, a second voltage generation unit configured to generate and supply a second direct voltage lower than the first direct voltage to the power line, a measurement unit configured to measure a voltage of the power line, a control unit configured to control supply of the first direct voltage with the first voltage generation unit after starting supply of the second direct voltage with the second voltage generation unit, and a determination unit configured to determine a state of the power supply device based on the measured voltage and a first threshold value after starting the supply of the second direct voltage.