公开(公告)号：US06577541B2

公开(公告)日：2003-06-10

申请号：US09931097

申请日：2001-08-17

申请人： Miwaka Takahashi ,  Toshiyuki Yokoyama

发明人： Miwaka Takahashi ,  Toshiyuki Yokoyama

IPC分类号： G11C700

CPC分类号： G11C11/4074 ,  G11C5/143 ,  G11C5/147 ,  G11C2207/104 ,  H01L27/0207

摘要： A function information storage section of each of a plurality of IPs of a device stores a plurality of sets of correlations between the working voltage V and the processing time T required when operated at this voltage. The device also includes a system controller for controlling the operation of each IP. When the voltage exceeds a limitation at a certain time as a result of analysis, the working voltage of each IP is changed to fall within the limitation.

公开(公告)号：US5609266A

公开(公告)日：1997-03-11

申请号：US244658

申请日：1994-08-09

申请人： Shinsaku Nakazato ,  Toshiyuki Yokoyama

发明人： Shinsaku Nakazato ,  Toshiyuki Yokoyama

IPC分类号： B29C51/04 ,  B29C51/10 ,  B65D1/26 ,  B65D8/18 ,  B65D17/28 ,  B65D25/44

CPC分类号： B29C51/04 ,  B65D1/26 ,  B65D25/44 ,  B29C2791/006 ,  B29C51/10

摘要： The refilling container of the present invention is a simplified container for use in containing a refilling detergent and the like. A number of the refilling containers can be laied at a limited space. The refilling container can be refilled with a content easily and surely, and can be disposed easily. The refilling container is comprised of a thermoformed container body and a seal film for sealing an opening positioned at the lower end of the container body. A tapered cylindrical shoulder portion is continuously connected to the upper end of the barrel portion of the container body, and from the center portion of the shoulder portion, a nozzle cylinder 4 closed by a platen 21 at the extreme end thereof extends upwardly. In ease of such as refilling a content in the container body or displaying the refilling container after filled with a content, the refilling container is converted to the state of the shoulder portion being subsided in the barrel portion, while in ease of reffilling a content in another container, it is converted to the state of the shoulder portion being projected from the barrel portion and then the extreme end of the nozzle cylinder is cut to form an injection port.

摘要翻译： PCT No.PCT / JP93 / 01475第 371日期1994年8月9日 102（e）日期1994年8月9日PCT提交1993年10月14日PCT公布。 出版物WO94 / 08860 日期1994年04月28日本发明的再填充容器是用于容纳补液性洗涤剂等的简化容器。 可以在有限的空间放置多个加注容器。 补充容器可以容易且可靠地重新填充内容物，并且可以容易地设置。 再填充容器由热成形容器主体和用于密封位于容器主体下端的开口的密封膜构成。 锥形圆柱形肩部连续地连接到容器主体的筒部的上端，并且从肩部的中心部分，在其末端由压板21封闭的喷嘴筒4向上延伸。 为了容易地填充容器主体中的内容或在填充内容物之后显示再填充容器，则再填充容器被转换为在筒部中平息的肩部的状态，同时容易地将内容物 另一个容器，转换成从筒部突出的肩部的状态，然后切断喷嘴筒的前端，形成注入口。

公开(公告)号：US08611736B2

公开(公告)日：2013-12-17

申请号：US13325275

申请日：2011-12-14

申请人： Akira Ando ,  Toshiyuki Yokoyama ,  Tomoaki Nishiguchi

发明人： Akira Ando ,  Toshiyuki Yokoyama ,  Tomoaki Nishiguchi

IPC分类号： G03B13/36

CPC分类号： G02B7/28 ,  G03B13/36 ,  H04N5/23212

摘要： For preventing frequent use of auto-focus control and also for acquiring stable in-focus positions for target-objects, this invention comprises system control section 60 having a second mode to drive magnification adjustment lens 11 or focus adjustment lens 12 upon a user command, and a third mode to transition to a first mode under pre-determined conditions in the second mode, and to set in-focus states of a lens group, wherein system control section 60 stores a reference target-object distance in reference target-object distance storage section 43 when focus adjustment lens 12 is driven by user commands in the second mode, drives focus adjustment lens 12 not based on a current target-object distance but the lens in-focus trajectory data to retain the reference target-object distance when the magnification adjustment lens 11 is driven by user commands, and re-transitions to the second mode without updating the reference target-object distance, after the third mode.

摘要翻译： 为了防止频繁使用自动对焦控制并且还用于获取目标物体的稳定的对焦位置，本发明包括具有用户命令驱动倍率调节透镜11或聚焦调节透镜12的第二模式的系统控制部分60， 以及在第二模式中在预定条件下转变到第一模式的第三模式，并且设置透镜组的对焦状态，其中系统控制部分60将参考目标对象距离存储在参考目标对象距离 在第二模式中通过用户命令驱动聚焦调节透镜12时，存储部分43不是基于当前目标物距离而驱动聚焦调节透镜12，而是在透镜对焦轨迹数据中保持基准目标物距 倍率调节透镜11由用户命令驱动，并且在第三模式之后重新转换到第二模式而不更新参考目标对象距离。

公开(公告)号：US08173037B2

公开(公告)日：2012-05-08

申请号：US12008350

申请日：2008-01-10

申请人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

发明人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

IPC分类号： H01L21/302

CPC分类号： B24B49/10 ,  H01L22/26

摘要： A wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like after the film thickness of the conductive film decreases to an extremely small film thickness defined by the skin depth. A high-frequency transmission path is formed in a portion facing the conductive film on the surface of the wafer, the polishing removal state of the conductive film is evaluated based at least on the transmitted electromagnetic waves passing through the high-frequency transmission path or the reflected electromagnetic waves that are reflected without passing through the high-frequency transmission path, and the end point of the polishing removal and the point equivalent to the end point of the polishing removal are detected.

摘要翻译： 一种晶片抛光剂监测方法和装置，其通过在导电膜的膜厚度之后监测导电膜的膜厚度的变化而不受浆料等的影响而高精度和精确地检测导电膜的抛光终点 导电膜减少到由皮肤深度限定的非常小的膜厚度。 在晶片的表面上面对导电膜的部分形成高频传输路径，至少基于通过高频传输路径的传输电磁波或导电膜的抛光去除状态来评估导电膜的抛光去除状态 反射的电磁波被反射而不通过高频传输路径，并且检测抛光去除的终点和与抛光去除的终点相当的点。

公开(公告)号：US20110292525A1

公开(公告)日：2011-12-01

申请号：US13117175

申请日：2011-05-27

申请人： Akira Ando ,  Toshiyuki Yokoyama ,  Hideharu Ono ,  Tomoaki Nishiguchi ,  Hiroyuki Miyahara

发明人： Akira Ando ,  Toshiyuki Yokoyama ,  Hideharu Ono ,  Tomoaki Nishiguchi ,  Hiroyuki Miyahara

IPC分类号： G02B7/04

CPC分类号： G03B3/10 ,  G02B7/28 ,  G03B13/34 ,  H04N5/23212

摘要： In order to obtain stable lens positions to have an object imaged in focus when the temperature of lenses changes, an imaging device of the present invention comprises a system control section 60 having a imaging mode and a correction mode, the imaging mode in which a group of lenses 10 are controlled and moved to focusing positions for a predetermined distance at first and are further moved to correct the focusing positions for the predetermined distance to the object during imaging according to the temperature compensation data, the correction mode in which the group of lenses 10 are controlled and moved to have the temperature compensation data corrected when the temperature change is larger than or equal to a predetermined temperature difference, a correction coefficient calculation section 50 for calculating the correction coefficient to correct the temperature compensation data based on first focusing positions of the group of lenses to which the group of lenses are moved according to the temperature compensation data before corrected and second focusing positions of the group of the lenses to which the group of the lenses are automatically moved from the first focusing positions to have the object the predetermined distance away imaged in focus based on the focus evaluation value under a condition under which a moving range of the group of lenses is restricted, when the system control section is on the correction mode, a temperature compensation data correction section 51 for correcting the temperature compensation data to be used for the imaging mode based on the correction coefficient calculated by the correction coefficient calculation section.

摘要翻译： 为了获得稳定的透镜位置以使透镜的温度变化时成像为对象，本发明的成像装置包括具有成像模式和校正模式的系统控制部60，其中，组 透镜10被控制并首先移动到聚焦位置预定距离，并且根据温度补偿数据进一步移动以在成像期间将对焦位置校正到物体预定距离，该组透镜 10被控制并移动以使温度补偿数据在温度变化大于或等于预定温度差时被校正;校正系数计算部分50，用于基于第一聚焦位置计算修正系数以校正温度补偿数据; 一组透镜组合的镜片组合 根据该组透镜的校正和第二聚焦位置之间的温度补偿数据自动地从第一聚焦位置移动，以使物体的预定距离远离成像焦点的焦点评估值 在该组透镜的移动范围被限制的条件下，当系统控制部分处于校正模式时，温度补偿数据校正部分51用于校正要用于成像模式的温度补偿数据，该温度补偿数据基于 由校正系数计算部计算出的校正系数。

公开(公告)号：US07762803B2

公开(公告)日：2010-07-27

申请号：US12007454

申请日：2008-01-10

申请人： Shinsaku Nakazato ,  Yasuo Takeshita ,  Toshiyuki Yokoyama

发明人： Shinsaku Nakazato ,  Yasuo Takeshita ,  Toshiyuki Yokoyama

IPC分类号： B29C43/56

CPC分类号： B65D3/12 ,  B29C51/04 ,  B29C51/10 ,  B29C51/343 ,  B29C51/36 ,  B29C51/40 ,  B29C2791/001 ,  B29C2791/006 ,  B29C2791/007 ,  B29L2031/7132 ,  B65D1/26 ,  B65D1/42

摘要： The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.

摘要翻译： 本发明提供一种有底的圆柱形容器，其包括体壁，底壁和从底壁向下延伸的环形脚，所述容器通过热塑树脂板制成，其特征在于，所述脚形成 通过用压缩流体折叠内壁以与外壁熔合，从而形成包括内壁和外壁的脚。 本发明还提供了一种有底圆柱形容器，其包括在其下端具有接地边缘的主体壁和底壁，所述容器通过热塑树脂板制造，其特征在于，所述底壁与 通过沿着接地边缘折叠主体壁并通过将其熔合到体壁的内周而产生的内壁的上边缘。 此外，本发明提供了这些容器及其装置的热成型方法。

公开(公告)号：US20090256558A1

公开(公告)日：2009-10-15

申请号：US12319403

申请日：2009-01-07

申请人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

发明人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

IPC分类号： G01B7/06

CPC分类号： G01B7/105

摘要： Coil is made to be disposed with gap opposed to the surface of wafer, and wafer stage is made to move in X and Y direction and R and θ direction. When supplying an alternating current to coil with the frequency swept by impedance analyzer, the magnetic field made to be induced in coil will operate on the conductive film of wafer. By changing a parameter (a frequency or an angle) influencing the skin effect of the conductive film and giving the parameter to coil, the state where a magnetic field is not made to penetrate relatively the film of wafer and the state where the magnetic field is made to penetrate relatively the film can be formed. From the variation of various values corresponding to the eddy current induced based on the change of state influenced by the skin effect of the conductive film, the film thickness of wafer can be measured with sufficient accuracy.

摘要翻译： 将线圈设置成与晶片表面相对的间隙，并且使晶片台在X和Y方向以及R和θ方向上移动。 当用阻抗分析仪扫描的频率向线圈提供交流电时，在线圈中感应的磁场将在晶片的导电膜上工作。 通过改变影响导电膜的皮肤效应并给出线圈参数的参数（频率或角度），没有使磁场相对于晶片的膜渗透的状态和磁场为 可以形成相对渗透的薄膜。 根据由导电膜的皮肤效应影响的状态变化引起的涡电流对应的各种值的变化，可以以足够的精度测量晶片的膜厚度。

公开(公告)号：US20090194916A1

公开(公告)日：2009-08-06

申请号：US12385401

申请日：2009-04-07

申请人： Shinsaku Nakazato ,  Yasuo Takeshita ,  Toshiyuki Yokoyama

发明人： Shinsaku Nakazato ,  Yasuo Takeshita ,  Toshiyuki Yokoyama

IPC分类号： B29C51/10

CPC分类号： B65D3/12 ,  B29C51/04 ,  B29C51/10 ,  B29C51/343 ,  B29C51/36 ,  B29C51/40 ,  B29C2791/001 ,  B29C2791/006 ,  B29C2791/007 ,  B29L2031/7132 ,  B65D1/26 ,  B65D1/42

摘要： The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.

摘要翻译： 本发明提供一种有底的圆柱形容器，其包括体壁，底壁和从底壁向下延伸的环形脚，所述容器通过热塑树脂板制成，其特征在于，所述脚形成 通过用压缩流体折叠内壁以与外壁熔合，从而形成包括内壁和外壁的脚。 本发明还提供了一种有底圆柱形容器，其包括在其下端具有接地边缘的主体壁和底壁，所述容器通过热塑树脂板制造，其特征在于，所述底壁与 通过沿着接地边缘折叠主体壁并通过将其熔合到体壁的内周而产生的内壁的上边缘。 此外，本发明提供了这些容器及其装置的热成型方法。

公开(公告)号：US20090061733A1

公开(公告)日：2009-03-05

申请号：US12228945

申请日：2008-08-18

申请人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

发明人： Takashi Fujita ,  Toshiyuki Yokoyama ,  Keita Kitade

IPC分类号： B24B49/00

CPC分类号： B24B37/013

摘要： [Problem to be Solved] To provide a method and device for forecasting/detecting a polishing end point and a method and device for monitoring a real-time film thickness to suppress Joule heat loss due to the eddy current to the minimum, to precisely forecast/detect an polishing end point, to precisely calculate the remaining film thickness to be removed, polishing rate and the like on the spot, and to precisely evaluate whether the predetermined conductive film is appropriately removed[Solution] In order to achieve the object, according to the present invention, there is provided a method wherein an inductor 36 in a high frequency inductor type sensor is arranged adjacent to a predetermined conductive film 28, and a magnetic flux change induced in the predetermined conductive film 28 by a magnetic flux formed of the inductor 36 is monitored, and by use of a magnetic flux change when a film thickness becomes corresponding to skin depth in which a film thickness in polishing is determined by the material of the predetermined conductive film 28 as a factor, a magnetic flux change part to forecast a polishing end point in the magnetic flux change process is detected, and an polishing end point is forecasted from the magnetic flux change part, and further a polishing rate and a remaining film thickness amount to be removed are calculated on the spot.

摘要翻译： [待解决的问题]提供一种用于预测/检测抛光终点的方法和装置，以及用于监测实时膜厚度以将由于涡流引起的焦耳热损失抑制到最小的方法和装置，以精确地预测 /检测抛光终点，精确地计算要去除的剩余膜厚度，抛光速度等，并精确评估预定导电膜是否被适当地去除[解决方案]为了实现该目的，根据 在本发明中，提供了一种方法，其中将高频电感型传感器中的电感器36布置成与预定的导电膜28相邻，并且由预定的导电膜28形成的磁通量在预定的导电膜28中感应的磁通量变化 监测电感器36，并且当膜厚度对应于确定研磨中的膜厚度的趋肤深度时，通过使用磁通量变化 d作为因子的预定导电膜28的材料，检测用于预测磁通变化过程中的抛光终点的磁通量变化部分，并且从磁通量变化部分预测抛光终点，并且进一步 在现场计算抛光速率和待除去的剩余膜厚度。

公开(公告)号：US20080248723A1

公开(公告)日：2008-10-09

申请号：US12080200

申请日：2008-04-01

申请人： Toshiyuki Yokoyama ,  Takashi Fujita ,  Katsunori Tanaka

发明人： Toshiyuki Yokoyama ,  Takashi Fujita ,  Katsunori Tanaka

IPC分类号： B24B49/03 ,  B24B51/00 ,  G06F19/00

CPC分类号： B24B49/03 ,  B24B51/00

摘要： To eliminate the unevenness of the film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the production yield. A CMP apparatus 1 includes a film thickness measuring means 6 that measures the film thickness of the wafers before polishing, a polishing recipe preparing means 7 that prepares polishing conditions so that the polishing conditions such as polishing speed, polishing pressure, and the like for the wafers become optimal, a polishing time forecasting means that forecasts the polishing time of the wafer on the basis of the optimal polishing condition and the measured value, a polishing time measuring means that measures the actual polishing time of the wafer, and a computer 9 that controls the polishing condition on the basis of the measured value and the like of the polishing time. Further, the computer 9 includes a calculating unit 23 that calculate the difference between the measured value of the polishing time and the forecasted value thereof, and a polishing condition correcting/changing unit 24 that corrects/changes the polishing conditions so that the calculated difference becomes minimal, and thereby, the correction/change of the polishing conditions is carried out in real time.

摘要翻译： 为了消除晶片的膜厚不匀，提高抛光效率，降低运行成本，提高生产成品率。 CMP装置1包括测量抛光之前的晶片的膜厚的膜厚度测量装置6，准备抛光条件的抛光配方准备装置7，以便抛光速度，抛光压力等的抛光条件用于 抛光时间预测装置，其基于最佳抛光条件和测量值预测晶片的抛光时间，抛光时间测量装置，其测量晶片的实际抛光时间;以及计算机9，其中， 基于抛光时间的测量值等来控制抛光条件。 此外，计算机9包括：计算抛光时间的测量值与其预测值之间的差的计算单元23;以及抛光条件校正/改变单元24，其校正/改变抛光条件，使得计算的差变为 最小化，从而实时地进行研磨条件的校正/变更。