摘要:
The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.
摘要:
The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.
摘要:
The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.
摘要:
The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.
摘要:
The refilling container of the present invention is a simplified container for use in containing a refilling detergent and the like. A number of the refilling containers can be laied at a limited space. The refilling container can be refilled with a content easily and surely, and can be disposed easily. The refilling container is comprised of a thermoformed container body and a seal film for sealing an opening positioned at the lower end of the container body. A tapered cylindrical shoulder portion is continuously connected to the upper end of the barrel portion of the container body, and from the center portion of the shoulder portion, a nozzle cylinder 4 closed by a platen 21 at the extreme end thereof extends upwardly. In ease of such as refilling a content in the container body or displaying the refilling container after filled with a content, the refilling container is converted to the state of the shoulder portion being subsided in the barrel portion, while in ease of reffilling a content in another container, it is converted to the state of the shoulder portion being projected from the barrel portion and then the extreme end of the nozzle cylinder is cut to form an injection port.
摘要:
A database for design of an integrated circuit device having data stored therein in a flexibly utilizable state, and a method for designing an integrated circuit device using such a database. A virtual core database (VCDB) for storing design data and a VCDB management system (VCDBMS) as a control system are provided. The VCDB includes virtual core (VC) clusters, test vector clusters, and purpose-specific function testing models. The VCDB also includes a system testing database having shared test clusters and peripheral model clusters. The VCDBMS includes a function testing assist section for generating test scenarios, the purpose-specific function testing models, system testing models, and the like, a VC interface synthesis section, and the like.
摘要:
An unevenness elimination end-point detection apparatus for a CMP apparatus which polishes a film to be polished formed on a wafer surface includes: light irradiation means for irradiating a light on a polishing surface of the wafer during polishing of the wafer; photoelectric conversion means for converting a light intensity of a reflected light from the polishing surface into an electric signal to output the electric signal as a light intensity signal; and determination means for determining an elimination end-point of the initial unevenness of the wafer on the basis of the light intensity signal output from the photoelectric conversion means. The irradiated light is white light and the white light is split and input to the photoelectric conversion means, and light intensity signals are output in units of wavelengths of split lights. In this manner, an elimination end-point of the initial unevenness can be optically detected during wafer polishing.
摘要:
An encryption process is employed in the LSI design so as to improve confidentiality of the circuit design data over conventional examples. In the encryption process, confidential circuit design data is encrypted to produce encrypted design data and a cipher key. The encrypted design data is provided to the user who conducts a design/verification process. The key is also provided as required. In the design/verification process, the encrypted design data is subjected to various processes without disclosing the contents of the original circuit. In a decoding process, the encrypted design data subjected to the design/verification process is decoded to produce original circuit design data.
摘要:
In order to obtain stable lens positions to have an object imaged in focus when the temperature of lenses changes, an imaging device of the present invention comprises a system control section 60 having a imaging mode and a correction mode, the imaging mode in which a group of lenses 10 are controlled and moved to focusing positions for a predetermined distance at first and are further moved to correct the focusing positions for the predetermined distance to the object during imaging according to the temperature compensation data, the correction mode in which the group of lenses 10 are controlled and moved to have the temperature compensation data corrected when the temperature change is larger than or equal to a predetermined temperature difference, a correction coefficient calculation section 50 for calculating the correction coefficient to correct the temperature compensation data based on first focusing positions of the group of lenses to which the group of lenses are moved according to the temperature compensation data before corrected and second focusing positions of the group of the lenses to which the group of the lenses are automatically moved from the first focusing positions to have the object the predetermined distance away imaged in focus based on the focus evaluation value under a condition under which a moving range of the group of lenses is restricted, when the system control section is on the correction mode, a temperature compensation data correction section 51 for correcting the temperature compensation data to be used for the imaging mode based on the correction coefficient calculated by the correction coefficient calculation section.
摘要:
Coil is made to be disposed with gap opposed to the surface of wafer, and wafer stage is made to move in X and Y direction and R and θ direction. When supplying an alternating current to coil with the frequency swept by impedance analyzer, the magnetic field made to be induced in coil will operate on the conductive film of wafer. By changing a parameter (a frequency or an angle) influencing the skin effect of the conductive film and giving the parameter to coil, the state where a magnetic field is not made to penetrate relatively the film of wafer and the state where the magnetic field is made to penetrate relatively the film can be formed. From the variation of various values corresponding to the eddy current induced based on the change of state influenced by the skin effect of the conductive film, the film thickness of wafer can be measured with sufficient accuracy.