Abstract:
A system including an inspection robot having a plurality of sensors, a further sensor, and a controller. The controller having circuitry to receive inspection data with a first resolution from the plurality of sensors, determine a characteristic on the inspection surface based on the inspection data, and provide an inspection operation adjustment in response to the characteristic, wherein the inspection operation adjustment includes a change from the first resolution to a second resolution. The change from the first resolution to the second resolution includes enabling the further sensor where the further sensor is at least one of: horizontally distributed with or vertically displaced from the plurality of sensors relative to a travel path of the plurality of sensors, and at least one of: offset in alignment from the travel path of the plurality of sensors, or operated out of phase with the plurality of sensors.
Abstract:
A system includes an inspection robot having a plurality of input sensors, the plurality of input sensors distributed horizontally relative to an inspection surface and configured to provide inspection data of the inspection surface at selected horizontal positions; a controller, comprising: a position definition circuit structured to determine an inspection robot position of the inspection robot on the inspection surface; a data positioning circuit structured to interpret the inspection data, and to correlate the inspection data to the inspection robot position on the inspection surface; and wherein the data positioning circuit is further structured to determine position informed inspection data in response to the correlating of the inspection data with the inspection robot position.
Abstract:
An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
Abstract:
A method and apparatus to determine a parameter of a metal-containing film are provided herein. In some embodiments, a method of determining a parameter of a metal-containing film may include generating a first magnetic field by flowing an alternating current through a coil disposed adjacent to and spaced apart from the metal-containing film, wherein the first magnetic field induces a second magnetic field proximate the metal-containing film; heating the metal-containing film from a first temperature to a second temperature; measuring a response of the first magnetic field to the second magnetic field as the metal-containing film is heated from the first temperature to the second temperature; and correlating the response with a rate of temperature change of the metal-containing film as the metal-containing film is heated from the first temperature to the second temperature to determine a parameter of the metal-containing film.
Abstract:
A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.
Abstract:
The invention relates to a measuring probe for measuring the thickness of thin layers with a housing, having at least one sensor element, which is received in the housing at least slightly moveably along a longitudinal axis and which comprises at least one winding device, which is allocated to the longitudinal axis, having a spherical positioning cap facing the outer front face of the housing, said cap being arranged in the longitudinal axis, wherein the spherical positioning cap has a basic body that has a cylindrical core section and a pole cap arranged on a front face of the core section, wherein the winding device is allocated to the spherical positioning cap, said winding device being formed from a discoidal or annular carrier with at least one Archimedean coil arranged thereon and with the basic body consisting of a ferritic material and the pole cap consisting of a hard metal.
Abstract:
A nondestructive system and method for measuring non-conductive coating thickness is disclosed. The method includes providing a composite substrate, placing a conductive layer over a surface of the composite substrate, and depositing a plurality of non-conductive coating layers over the conductive layer. An eddy-current measuring coil formed on a printed circuit board is provided atop the coating layers. The coil has a driving trace with first and second driving electrodes, and a receiving trace having first and second receiving electrodes. The receiving and driving traces can be either coaxial or interwoven, are spaced apart, and share a common center. A load administered to the first and second driving electrodes using an eddyscope is measured across the first and second receiving electrodes to determine impedance; the measured impedance is used to determine a total thickness of the plurality of coating layers and whether an overall coating thickness is uniform.
Abstract:
A detection device includes a chamber for vacuum coating, a capacitance measurement device and a baffle mechanism located in the chamber. The baffle mechanism is a closed structure encompassed by a number of baffle walls, wherein at least one baffle wall includes a fixed baffle plate and a moveable baffle plate. The moveable baffle plate is pivotable about the fixed baffle plate. The moveable baffle plate, after pivoting, may get parallel with an adjacent baffle wall. The adjacent baffle wall and the moveable baffle plate are respectively connected to the capacitance measurement device, and the capacitance measurement device is used to measure the capacitance between the adjacent baffle wall and the moveable baffle plate. The detection device may accurately detect the service life of the baffle mechanism and achieve precise management of the apparatus.
Abstract:
A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.
Abstract:
A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.