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    Dual Curing Polymers and Methods for Their Preparation and Use
    21.
    发明申请
    Dual Curing Polymers and Methods for Their Preparation and Use 有权
    双固化聚合物及其制备和使用方法

    公开(公告)号：US20100092690A1

    公开(公告)日：2010-04-15

    申请号：US12517211

    申请日：2007-11-07

    申请人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

    发明人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

    IPC分类号： C08F2/48 ,  C08G77/04 ,  C08G77/12 ,  C08F2/46 ,  B05D3/02 ,  B05D5/12

    CPC分类号： C08G77/50 ,  C08J3/243 ,  C08J2383/04 ,  C08K5/54 ,  C09D183/14 ,  Y10T428/31663

    摘要： A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    摘要翻译： 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式（R22SiO2 / 2）b，（R2Si03 / 2）c，（SiO4 / 2）d，（R1'）f和（R23Si01 / 2）g的单元，其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。