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公开(公告)号：US20240266738A1
公开(公告)日：2024-08-08
申请号：US18293173
申请日：2021-07-29
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
CPC classification number: H01Q5/50 , H01Q9/0414 , H05K1/0243 , H05K1/115
Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.
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公开(公告)号：US20240006758A1
公开(公告)日：2024-01-04
申请号：US18255288
申请日：2021-12-06
Applicant: LG ELECTRONICS INC.
Inventor： Doojung KIM , Seungmin WOO , Dongwan ROH
CPC classification number: H01Q1/526 , H01Q9/0421 , H04B1/0064 , H04B1/40 , H01Q1/2291
Abstract: A communication module according to the present embodiment comprises: a substrate in which a ground shield protrudes from a main body; at least one communication chip provided in the main body; a first antenna having a first feeding unit and a first ground that are connected to the main body; and a second antenna which has a second feeding unit and a second ground that are connected to the main body, and which is spaced from the first antenna, wherein the ground shield protrudes between the first antenna and the second antenna, and at least one hole can be formed in the ground shield.
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公开(公告)号：US20230079358A1
公开(公告)日：2023-03-16
申请号：US17797401
申请日：2020-02-04
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO
Abstract: An electronic device including an antenna, according to one embodiment, is provided. The electronic device can comprise: a first radiator in which metal patterns having a predetermined width and length are stacked on different layers of a multi-layer substrate; and a second radiator in which metal patterns having a predetermined width and length are stacked on top of the first radiator. The electronic device can further comprise a transceiver circuit for connecting to any one metal pattern from among the first radiator and the second radiator through a feeding line.
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公开(公告)号：US20230041218A1
公开(公告)日：2023-02-09
申请号：US17758815
申请日：2020-03-06
Inventor： Kukheon CHOI , Ilnam CHO , Seungmin WOO , Byeongyong PARK , Jeongwook KIM , Jongwon YU , Kwangseok KIM
IPC: H04B7/0413 , H01Q1/24 , H01Q9/04 , H01Q1/48 , H01Q1/32
Abstract: Provided according to the present invention is an electronic device having an antenna. The electronic device may comprise: a transparent antenna built into a display and configured to emit a signal to the front of the display; and a transmission line for feeding the transparent antenna. The transparent antenna is configured as a rectangular patch rotated at a predetermined angle, and a portion of the left and right-side areas of the rectangular patch may be formed as vertical lines.
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公开(公告)号：US20220384933A1
公开(公告)日：2022-12-01
申请号：US17755854
申请日：2019-12-05
Applicant: LG ELECTRONICS INC.
Inventor： Kukheon CHOI , Ilnam CHO , Seungmin WOO , Byeongyong PARK
IPC: H01Q1/24 , H04B7/0413 , H01Q1/36 , H01Q9/04
Abstract: Provided is an electronic device having a transparent antenna for 5G communication according to the present invention. The electronic device comprises: a transparent antenna embedded in a display to emit a signal to the front surface of the display; and a transmission line for feeding power to the transparent antenna. The transparent antenna includes: a first emitter configured as a first metal mesh grid on a first substrate; and a second emitter configured as a second metal mesh grid on a second substrate disposed above the first substrate.
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Patent Agency Ranking
公开(公告)号：US20210111492A1
公开(公告)日：2021-04-15
申请号：US16815670
申请日：2020-03-11
Applicant: LG ELECTRONICS INC.
Inventor： Doojung KIM , Seungmin WOO
Abstract: Disclosed is a dual antenna including a radiation circuit. The radiation circuit includes a first pattern having an L shape, a second pattern having a meandering shape, a feed line electrically connected to the first pattern and the second patter, and a ground line spaced apart from the feed line and electrically connected to the first pattern and the second pattern.
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公开(公告)号：US20200245452A1
公开(公告)日：2020-07-30
申请号：US16852004
申请日：2020-04-17
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO
Abstract: The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.
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28.发明申请公开(公告)号：US20250070450A1
公开(公告)日：2025-02-27
申请号：US18755500
申请日：2024-06-26
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.
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公开(公告)号：US20250070447A1
公开(公告)日：2025-02-27
申请号：US18737181
申请日：2024-06-07
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. Each of the plurality of antenna elements may have a structure with two patch antennas, and first and second groups of second patch antennas disposed inside the PCB may be located in first and second regions with respect to a center line of an inner layer where the second patch antennas are disposed.
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公开(公告)号：US20250007146A1
公开(公告)日：2025-01-02
申请号：US18734976
申请日：2024-06-05
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented in a multi-layered antenna package includes an RFIC; a first dielectric layer; a first coplanar waveguide layer disposed on a top of the first dielectric layer and configured to receive RF signals transmitted by an interface layer of the RFIC; a first antenna portion disposed on the first coplanar waveguide layer and configured to radiate signals transmitted from the first coplanar waveguide layer; a second coplanar waveguide layer disposed on a top of the third dielectric layer and configured to receive RF signals transmitted by the interface layer of the RFIC; and a second antenna portion disposed on the second coplanar waveguide layer to radiate signals transmitted from the second coplanar waveguide layer.
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