公开(公告)号：US07977728B2

公开(公告)日：2011-07-12

申请号：US12715455

申请日：2010-03-02

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L29/788

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US20060038218A1

公开(公告)日：2006-02-23

申请号：US11087592

申请日：2005-03-24

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L29/76

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US20100184266A1

公开(公告)日：2010-07-22

申请号：US12715455

申请日：2010-03-02

申请人： Toshitake YAEGASHI ,  Yoshio Ozawa

发明人： Toshitake YAEGASHI ,  Yoshio Ozawa

IPC分类号： H01L21/8234

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US07687346B2

公开(公告)日：2010-03-30

申请号：US11943325

申请日：2007-11-20

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L21/336

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜，以及形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US08330204B2

公开(公告)日：2012-12-11

申请号：US13164946

申请日：2011-06-21

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L29/788

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US07309891B2

公开(公告)日：2007-12-18

申请号：US11087592

申请日：2005-03-24

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L29/788

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US08354705B2

公开(公告)日：2013-01-15

申请号：US13164950

申请日：2011-06-21

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L29/778 ,  H01L21/336

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜和形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US20080070362A1

公开(公告)日：2008-03-20

申请号：US11943325

申请日：2007-11-20

申请人： Toshitake YAEGASHI ,  Yoshio Ozawa

发明人： Toshitake YAEGASHI ,  Yoshio Ozawa

IPC分类号： H01L21/336

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

摘要翻译： 半导体集成电路器件包括：第一，第二栅电极，第一，第二扩散层，电连接到第一扩散层的接触电极;第一绝缘膜，其在第一和第二栅电极之间具有凹入部分，并且不含氮作为 主要成分，形成在第一绝缘膜上并且不含氮作为主要成分的第二绝缘膜，以及形成在第一扩散层上的第三绝缘膜，第一栅电极，第二扩散层和第二栅电极， 第二绝缘膜设置在部分区域之间。 形成第二绝缘膜以填充凹部，并且第一和第二栅电极之间的部分具有至少包含第一绝缘膜和第二绝缘膜的多层结构。

公开(公告)号：US20110248330A1

公开(公告)日：2011-10-13

申请号：US13164950

申请日：2011-06-21

申请人： Toshitake Yaegashi ,  Yoshio Ozawa

发明人： Toshitake Yaegashi ,  Yoshio Ozawa

IPC分类号： H01L27/105 ,  H01L29/788

CPC分类号： H01L27/115 ,  H01L27/11521

摘要： A semiconductor integrated circuit device includes first, second gate electrodes, first, second diffusion layers, contact electrodes electrically connected to the first diffusion layers, a first insulating film which has concave portions between the first and second gate electrodes and does not contain nitrogen as a main component, a second insulating film which is formed on the first insulating film and does not contain nitrogen as a main component, and a third insulating film formed on the first diffusion layers, first gate electrodes, second diffusion layers and second gate electrodes with the second insulating film disposed therebetween in a partial region. The second insulating film is formed to fill the concave portions and a portion between the first and second gate electrodes has a multi-layered structure containing at least the first and second insulating films.

公开(公告)号：US08455346B2

公开(公告)日：2013-06-04

申请号：US13075658

申请日：2011-03-30

申请人： Yasuhiro Nojiri ,  Hiroyuki Fukumizu ,  Shinichi Nakao ,  Kei Watanabe ,  Kazuhiko Yamamoto ,  Ichiro Mizushima ,  Yoshio Ozawa

发明人： Yasuhiro Nojiri ,  Hiroyuki Fukumizu ,  Shinichi Nakao ,  Kei Watanabe ,  Kazuhiko Yamamoto ,  Ichiro Mizushima ,  Yoshio Ozawa

IPC分类号： H01L21/4763 ,  G11C11/00

CPC分类号： H01L51/0591 ,  B82Y10/00 ,  B82Y40/00 ,  G11C13/0002 ,  G11C13/025 ,  G11C2213/71 ,  H01L27/2409 ,  H01L27/2481 ,  H01L45/04 ,  H01L45/149 ,  H01L45/1608

摘要： According to one embodiment, a method is disclosed for manufacturing a nonvolatile memory device. The nonvolatile memory device includes a memory cell connected to a first interconnect and a second interconnect. The method can include forming a first electrode film on the first interconnect. The method can include forming a layer including a plurality of carbon nanotubes dispersed inside an insulator on the first electrode film. At least one carbon nanotube of the plurality of carbon nanotubes is exposed from a surface of the insulator. The method can include forming a second electrode film on the layer. In addition, the method can include forming a second interconnect on the second electrode film.

摘要翻译： 根据一个实施例，公开了一种用于制造非易失性存储器件的方法。 非易失性存储器件包括连接到第一互连和第二互连的存储单元。 该方法可以包括在第一互连上形成第一电极膜。 该方法可以包括在第一电极膜上形成分散在绝缘体内的多个碳纳米管的层。 多个碳纳米管中的至少一个碳纳米管从绝缘体的表面露出。 该方法可以包括在该层上形成第二电极膜。 此外，该方法可以包括在第二电极膜上形成第二互连。