METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20230207222A1

    公开(公告)日:2023-06-29

    申请号:US18116430

    申请日:2023-03-02

    CPC classification number: H01G4/30 H01G4/012 Y10T29/435

    Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

    ELECTRONIC COMPONENT
    22.
    发明申请

    公开(公告)号:US20220020526A1

    公开(公告)日:2022-01-20

    申请号:US17371793

    申请日:2021-07-09

    Abstract: An electronic component includes a composite body made of a composite material of resin and magnetic metal particles, an inner electrode which is provided in the composite body and which has an end surface exposed from an outer surface of the composite body, and a metal film provided on the outer surface of the composite body and on the end surface of the inner electrode. The metal film includes a first region provided on the end surface of the inner electrode and a second region which is in contact with the magnetic metal particles exposed at the outer surface of the composite body and which is provided on the outer surface of the composite body. The thickness of the first region is less than the thickness of the second region.

    METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20210098195A1

    公开(公告)日:2021-04-01

    申请号:US17031971

    申请日:2020-09-25

    Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

    MULTILAYER METAL FILM AND INDUCTOR COMPONENT
    25.
    发明申请

    公开(公告)号:US20200312519A1

    公开(公告)日:2020-10-01

    申请号:US16830170

    申请日:2020-03-25

    Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.

    INDUCTOR COMPONENT
    27.
    发明申请

    公开(公告)号:US20170169930A1

    公开(公告)日:2017-06-15

    申请号:US15369073

    申请日:2016-12-05

    CPC classification number: H01F17/0013 H01F17/04 H01F27/292 H01F2017/048

    Abstract: An inductor component has a plurality of layers of spiral wirings a magnetic composite body directly or indirectly covering the plurality of layers of spiral wirings and made of a composite material of a resin and a metal magnetic powder with an average particle diameter of 5 μm or less an internal electrode embedded in the magnetic composite body with an end surface exposed from an outer surface of the magnetic composite body, the internal electrode being electrically connected to the spiral wirings, and an external terminal disposed on the outer surface of the magnetic composite body and electrically connected to the internal electrode.

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