公开(公告)号：US09728694B2

公开(公告)日：2017-08-08

申请号：US14683164

申请日：2015-04-10

Applicant: NICHIA CORPORATION

Inventor： Akinori Yoneda ,  Yoshiyuki Aihara ,  Shinji Nakamura

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/54 ,  H01L2224/94 ,  H01L2933/0033

Abstract: A light emitting device includes a semiconductor light emitting element, a resin layer, and a metal wire. The semiconductor light emitting element includes a semiconductor stack and an electrode. The semiconductor stack has one surface. The metal wire has a first surface, a second surface opposite to the first surface, and an end surface between the first surface and the second surface. The metal wire is provided in the resin layer and electrically connected to an upper surface of the electrode via the first surface. The end surface of the metal wire is exposed from the resin layer. A lower end of the end surface closest to the first surface of the metal wire that is exposed from the resin layer is provided at an opposite side of the one surface of the semiconductor stack with respect to the upper surface of the electrode.