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公开(公告)号：US11735686B2
公开(公告)日：2023-08-22
申请号：US17113583
申请日：2020-12-07
Applicant: NICHIA CORPORATION
Inventor： Yoshiki Inoue , Shun Kitahama , Yoshiyuki Aihara , Yoshiki Matsushita , Keisuke Higashitani
CPC classification number: H01L33/0095 , H01L33/007 , H01L33/22 , H01L33/507 , H01L2933/0041
Abstract: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.
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公开(公告)号：US09698307B2
公开(公告)日：2017-07-04
申请号：US14477617
申请日：2014-09-04
Applicant: Nichia Corporation
Inventor： Akinori Yoneda , Yoshiyuki Aihara , Shinji Nakamura , Akiyoshi Kinouchi , Kazuki Kashimoto , Kazuyuki Akaishi
CPC classification number: H01L33/385 , H01L33/387 , H01L33/405 , H01L33/486 , H01L33/54 , H01L33/62
Abstract: A side-view type light emitting device having a bottom surface thereof as a light emission surface and one side surface thereof as amounting surface for mounting on amounting substrate includes a stacked semiconductor layer having a first semiconductor layer, an active layer, and a second semiconductor layer which are stacked in that order from a side of the bottom surface; a first connecting electrode exposed from the one side surface and electrically connected to the first semiconductor layer; a metal wire having one end thereof electrically connected to an upper surface of the second semiconductor layer; a second connecting electrode exposed from the one side surface and electrically connected to the other end of the metal wire; and a resin layer which covers at least a part of each of the first semiconductor layer, the second semiconductor layer, the first connecting electrode, the second connecting electrode and the metal wire and which is configured to form an upper surface and side surfaces of the light emitting device.
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公开(公告)号：US10224470B2
公开(公告)日：2019-03-05
申请号：US15247188
申请日：2016-08-25
Applicant: NICHIA CORPORATION
Inventor： Akinori Yoneda , Akiyoshi Kinouchi , Hisashi Kasai , Yoshiyuki Aihara , Hirokazu Sasa , Shinji Nakamura
IPC: H01L33/62 , H01L33/38 , H01L33/24 , H01L33/56 , H01L33/50 , H01L33/40 , H01L23/00 , H01L21/683 , H01L33/48 , H01L33/54 , H01L21/60
Abstract: A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.
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公开(公告)号：US09136447B2
公开(公告)日：2015-09-15
申请号：US13953288
申请日：2013-07-29
Applicant: Nichia Corporation
Inventor： Akinori Yoneda , Shinji Nakamura , Yoshiyuki Aihara , Hirokazu Sasa
CPC classification number: H01L33/507 , H01L24/18 , H01L33/38 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2924/12041 , H01L2924/15788 , H01L2933/005 , H01L2924/00
Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.
Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。
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公开(公告)号：US08878218B2
公开(公告)日：2014-11-04
申请号：US14054868
申请日：2013-10-16
Applicant: Nichia Corporation
Inventor： Kosuke Sato , Yoshitaka Sumitomo , Dai Wakamatsu , Yoshiyuki Aihara , Kimihiro Miyamoto , Satoshi Kinoshita
CPC classification number: H01L33/10 , H01L33/005 , H01L33/0095 , H01L33/46 , H01L2924/0002 , H01L2924/00
Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer. The second metal layer has an adhesion with respect to the translucent substrate higher than the adhesion between the first metal layer and the translucent substrate.
Abstract translation: 本发明提供了在半透明基板的主表面上具有半导体层的半导体发光器件和与具有半导体层的主表面相对的第二主表面上的反射层，其能够使反射层从 透光性基板被抑制。 半导体发光器件包括与透光性基板的第二主面接触配置的第一金属层，与第一金属的至少第二主面或半透明基板的侧面相接触地设置的第二金属层 层和设置在第二金属层上的第三金属层。 第一金属层相对于从发光层发射的光的峰值波长的反射率高于第二金属层的反射率。 第二金属层相对于透光性基板具有比第一金属层和透光性基板之间的粘合性高的粘接性。
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Patent Agency Ranking
公开(公告)号：US20140027804A1
公开(公告)日：2014-01-30
申请号：US13953288
申请日：2013-07-29
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Shinji Nakamura , Yoshiyuki Aihara , Hirokazu Sasa
CPC classification number: H01L33/507 , H01L24/18 , H01L33/38 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2924/12041 , H01L2924/15788 , H01L2933/005 , H01L2924/00
Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.
Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。
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公开(公告)号：US09887337B2
公开(公告)日：2018-02-06
申请号：US15641231
申请日：2017-07-04
Applicant: NICHIA CORPORATION
Inventor： Akinori Yoneda , Yoshiyuki Aihara , Shinji Nakamura
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/54 , H01L2224/94 , H01L2933/0033
Abstract: A manufacturing method of a light emitting device includes preparing a wafer that is provided by arranging a plurality of semiconductor light emitting elements including semiconductor stacks and electrodes provided on first surfaces of the semiconductor stacks. A metal wire is wired in an arc shape between the electrodes of the plurality of semiconductor light emitting elements that are arranged in one direction on the wafer so as to connect each of the electrodes and the metal wire. A resin layer is provided on a side of the first surfaces of the semiconductor stacks in such a way that the metal wire is accommodated inside the resin layer. The wafer is cut along a boundary line to segment the plurality of semiconductor light emitting elements so as to singulate the plurality of semiconductor light emitting elements.
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公开(公告)号：US09755119B2
公开(公告)日：2017-09-05
申请号：US14599068
申请日：2015-01-16
Applicant: NICHIA CORPORATION
Inventor： Akinori Yoneda , Shinji Nakamura , Yoshiyuki Aihara
CPC classification number: H01L33/52 , H01L24/45 , H01L33/0095 , H01L33/38 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4903 , H01L2224/49107 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/20752 , H01L2924/20753 , H01L2924/00014 , H01L2924/00
Abstract: A method of manufacturing a light emitting device includes preparing wafer with a plurality of light emitting elements arrayed on a growth substrate, on a first side of a semiconductor stacked layer body, forming a resin layer which includes metal wires respectively connected to a p-side electrode and an n-side electrode, forming a groove by removing at least portion of the resin layer from an upper surface side in a boundary region between the light emitting elements and exposing end surfaces of metal wires which are internal conductive members on an inner side surface defining a groove, forming electrodes for external connection respectively connecting to exposed end surfaces of metal wires, and singulating the wafer into a plurality of singulated light emitting elements.
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公开(公告)号：US09461216B2
公开(公告)日：2016-10-04
申请号：US14745120
申请日：2015-06-19
Applicant: NICHIA CORPORATION
Inventor： Akinori Yoneda , Akiyoshi Kinouchi , Hisashi Kasai , Yoshiyuki Aihara , Hirokazu Sasa , Shinji Nakamura
IPC: H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119 , H01L33/56 , H01L33/62 , H01L33/38 , H01L23/00 , H01L21/683 , H01L33/24 , H01L33/40 , H01L33/50 , H01L33/48 , H01L33/54 , H01L21/60
CPC classification number: H01L33/62 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/85 , H01L24/96 , H01L33/24 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L2021/60 , H01L2221/6835 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2221/68386 , H01L2224/04105 , H01L2224/05644 , H01L2224/05647 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/215 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/2413 , H01L2224/245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48101 , H01L2224/4813 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/821 , H01L2224/82106 , H01L2224/85947 , H01L2224/96 , H01L2924/0002 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3511 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/00014 , H01L2224/82
Abstract: A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.
Abstract translation: 发光器件包括具有p型半导体层和n型半导体层的半导体芯片，该半导体芯片适于在p型半导体层和n型半导体层之间发光; p侧焊盘电极，设置在所述半导体芯片的上表面侧并且位于所述p型半导体层上方; 设置在所述半导体芯片的上表面侧并且位于所述n型半导体层上的n侧焊盘电极; 设置成覆盖半导体芯片的上表面的树脂层; p侧连接电极和n侧连接电极，设置在树脂层的外表面并位于半导体芯片的上表面侧; 以及设置在树脂中的金属线。 金属线适于连接p侧焊盘电极和p侧连接电极之间以及n侧焊盘电极和n侧连接电极之中的至少一个。
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10.发明授权公开(公告)号：US09324925B2
公开(公告)日：2016-04-26
申请号：US14808706
申请日：2015-07-24
Applicant: Nichia Corporation
Inventor： Akinori Yoneda , Shinji Nakamura , Yoshiyuki Aihara , Hirokazu Sasa
IPC: H01L27/15 , H01L31/12 , H01L33/00 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/38 , H01L33/54 , H01L23/00 , H01L33/46
CPC classification number: H01L33/507 , H01L24/18 , H01L33/38 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2924/12041 , H01L2924/15788 , H01L2933/005 , H01L2924/00
Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.
Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。
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