公开(公告)号：US08837874B2

公开(公告)日：2014-09-16

申请号：US13866273

申请日：2013-04-19

Applicant: Nitto Denko Corporation

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/122 ,  G02B6/136 ,  G02B6/138

CPC classification number: G02B6/122 ,  G02B6/136 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.

Abstract translation: 提供能够抑制光传播损耗增加和柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在绝缘层的背面上。 金属层形成在包覆层和绝缘层之间。 金属层的至少一部分形成为第一和第二图案之一。 第一图案包括点状突起的分布，第二图案包括点状凹部的分布。 第一包层填充通过图案化去除金属层的位置。

公开(公告)号：US08768114B2

公开(公告)日：2014-07-01

申请号：US13775445

申请日：2013-02-25

Applicant: Nitto Denko Corporation

Inventor： Yuichi Tsujita ,  Yasuto Ishimura ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/12

CPC classification number: G02B6/136 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

Abstract translation: 提供了能够抑制光传播损失增加并且柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导与电路板的绝缘层的背面之间。 图案化金属层以具有多个条带。 光波导的芯设置在与通过图案化去除金属层的位置相对应的位置。

公开(公告)号：US20130301980A1

公开(公告)日：2013-11-14

申请号：US13866273

申请日：2013-04-19

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/122 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/136 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.

Abstract translation: 提供能够抑制光传播损耗增加和柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在绝缘层的背面上。 金属层形成在包覆层和绝缘层之间。 金属层的至少一部分形成为第一和第二图案之一。 第一图案包括点状突起的分布，第二图案包括点状凹部的分布。 第一包层填充通过图案化去除金属层的位置。