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公开(公告)号：US20210206962A1
公开(公告)日：2021-07-08
申请号：US16071172
申请日：2017-01-20
Applicant: NITTO DENKO CORPORATION
Inventor： Tomoyuki Hirayama , Naoyuki Tanaka
Abstract: A photosensitive epoxy resin composition for formation of an optical waveguide is provided, which contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component includes: (a) a solid bisphenol-A epoxy resin having a softening point of not higher than 105° C.; (b) a solid polyfunctional aliphatic epoxy resin having a softening point of not higher than 105° C.; and (c) a liquid long-chain bifunctional semi-aliphatic epoxy resin, wherein the epoxy resin (a) is present in a proportion of 60 to 70 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (b) is present in a proportion of 20 to 35 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (c) is present in a proportion of 5 to 10 wt. % based on the weight of the epoxy resin component.
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公开(公告)号：US20200301067A1
公开(公告)日：2020-09-24
申请号：US16084689
申请日：2017-02-07
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka
Abstract: There is provided an optical waveguide laminate in which an organic base material layer comprised of an insulation layer and a coverlay is laminated to one surface of an optical waveguide and in which a portion of the organic base material layer is lacking so that the optical waveguide is uncovered. Inequalities P≥70% and P−Q≥25% are satisfied where P is the laser light transmittance in at least a portion of the optical waveguide, the laser light having a predetermined wavelength range, and Q is the laser light transmittance of at least a portion of the organic base material layer. In this optical waveguide laminate, the organic base material layer laminated to the optical waveguide is elaborately removed without being impaired or thermally damaged by laser machining.
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公开(公告)号：US10606002B2
公开(公告)日：2020-03-31
申请号：US15512963
申请日：2015-09-10
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Naoyuki Tanaka
Abstract: An opto-electric hybrid board includes an electric circuit board in which electric wiring is formed on a front surface of an insulating layer, and an optical waveguide formed on the rear side of the electric circuit board. The optical waveguide and the electric circuit board are arranged so that left and right edges of the electric circuit board along a longitudinal direction of the optical waveguide overlap with left and right edges of the optical waveguide when viewed from above, or so that the left and right edges of the electric circuit board are on the inside of where the left and right edges of the optical waveguide are located. The opto-electric hybrid board is easy to handle owing to the reduced chance of the electric circuit board being damaged. The opto-electric hybrid board also does not cause misalignment of a core when used as a connector.
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公开(公告)号：US10260939B2
公开(公告)日：2019-04-16
申请号：US15326702
申请日：2015-07-17
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Yuichi Tsujita
IPC: G01J1/04 , G02B6/42 , H01L31/0232 , G01J1/02 , G01J1/42
Abstract: There is provided an optical sensor in which a reduction in size of a light-receiving part is achieved. This optical sensor is installed in a device, and includes a light-receiving element 4 for receiving light coming from outside toward the device. The optical sensor detects the state of the received light. A linear optical waveguide 2 is connected to the light-receiving element 4 so as to be capable of light propagation. The optical waveguide 2 has a front end portion serving as a light entrance portion on which light coming from the outside of the device is incident.
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公开(公告)号：US20170307833A1
公开(公告)日：2017-10-26
申请号：US15517267
申请日：2015-10-09
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Naoyuki Tanaka
CPC classification number: G02B6/428 , G02B6/122 , G02B6/13 , H05K1/0269 , H05K1/0274 , H05K1/0326 , H05K1/0346 , H05K3/18 , H05K2201/0154 , H05K2201/09918 , H05K2201/10121 , H05K2203/166
Abstract: An opto-electric hybrid board is provided, which includes an electric circuit board including an electric wiring provided on a front surface of an insulation layer, an optical waveguide provided on a back side of the electric circuit board, and an outline processing alignment mark positioned adjacent to an outline processing portion on the front surface of the insulation layer on the same basis as the electric wiring, and has an outline formed by performing an outline processing operation with reference to the outline processing alignment mark . The opto-electric hybrid board has an accurate outline and, therefore, can be attached to other component without an engagement failure or a connection failure.
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Patent Agency Ranking
公开(公告)号：US20160238807A1
公开(公告)日：2016-08-18
申请号：US15030184
申请日：2014-08-18
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru
CPC classification number: H05K1/0274 , G02B6/122 , G02B6/138 , G02B6/42 , G02B6/4214 , G02B6/423 , G02B6/4245 , G02B6/4281 , G02B6/4283
Abstract: An opto-electric hybrid module is provided. In the opto-electric hybrid module, a core and an electric circuit including electric circuit body portions and mounting pads are provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted on the mounting pads with its electrodes in abutment against the mounting pads. The core is covered with the over-cladding layer, and a center portion of the optical element is positioned above a portion of the over-cladding layer covering a top surface of the core. A portion of the electric circuit excluding the mounting pads and a surface portion of the under-cladding layer present between the electric circuit body portions of the electric circuit and present between the electric circuit body portion and the mounting pad are covered with a core material layer formed of the same material as the core.
Abstract translation: 提供光电混合模块。 在光电混合模块中，在光波导的下敷层的表面设置有包括电路体部和安装焊盘的芯和电路。 光学元件安装在安装焊盘上，其电极邻接安装焊盘。 该芯被上包层覆盖，并且光学元件的中心部分位于覆盖芯的顶表面的上覆层的一部分上方。 存在于电路的电路主体部分之间并且存在于电路主体部分和安装焊盘之间的电路的不包括安装焊盘的部分和下包层的表面部分被芯材层 由与核心相同的材料形成。
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公开(公告)号：US09395505B2
公开(公告)日：2016-07-19
申请号：US14761398
申请日：2013-12-11
Applicant: NITTO DENKO CORPORATION
Inventor： Naoki Shibata , Yuichi Tsujita , Naoyuki Tanaka , Shotaro Masuda
CPC classification number: G02B6/4231 , G02B6/4214 , G02B6/428 , G02B6/4293 , H05K1/0274 , H05K2201/10121 , H05K2201/10189
Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.
Abstract translation: 提供了一种光电混合模块，其中光电元件单元的光学元件和光电混合单元的光波导的核心简单且精确地彼此对准。 光电混合模块包括：包括光学元件的连接器; 以及包括层叠在一起的包括电路板和光波导的光电混合单元。 连接器包括相对于光学元件定位和形成在预定位置的对准凸起。 光电混合单元包括用于与对准突起配合接合的装配孔，配合孔相对于光波导的芯的端表面定位并形成在预定位置。 连接器和光电混合单元耦合在一起。
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公开(公告)号：US09335497B2
公开(公告)日：2016-05-10
申请号：US13785553
申请日：2013-03-05
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru
CPC classification number: G02B6/4214 , G02B6/4204 , G02B6/4206 , G02B6/4283 , G02B6/43 , H05K1/0274 , H05K2201/10121
Abstract: An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.
Abstract translation: 光电混合基板包括：电路板，包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线; 安装在电路板的表面上的光学元件，其上形成有电互连线; 以及包括芯并形成在电路板的绝缘层的背面上的光波导。 芯在其端部包括能够反射光束以在光纤和光学元件之间传播光束的反射表面。 绝缘层由透光材料制成。 与芯体的反射面和光学元件之间的光路对应的绝缘层的一部分为透镜部的形式。
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公开(公告)号：US11320613B2
公开(公告)日：2022-05-03
申请号：US17040816
申请日：2018-03-30
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yuichi Tsujita
Abstract: An opto-electric hybrid board is capable of being mounted on a connector having a bottom wall. The opto-electric hybrid board sequentially includes an optical waveguide and an electric circuit board toward one side in a thickness direction of these. The optical waveguide includes an under clad layer, a core layer disposed on a one-side surface of the tinder clad layer, and an over clad layer disposed on the one-side surface of the under clad layer so as to cover the core layer. The under clad layer is in contact with an other-side surface in the thickness direction of the electric circuit board. The one-side surface in the thickness direction of the electric circuit board is capable of being placed on the bottom wall.
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公开(公告)号：US10353161B2
公开(公告)日：2019-07-16
申请号：US15516737
申请日：2015-10-09
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Naoyuki Tanaka
Abstract: An opto-electric hybrid board includes: an electric circuit board including electrical interconnect lines formed on the front surface of an insulation layer; a metal reinforcement layer formed partially on the back surface of the electric circuit board; an optical waveguide W configured to partially overlap the back surface of the electric circuit board E; and an second reinforcement layer formed on the back surface of the electric circuit board E. The second reinforcement layer allows the opto-electric hybrid board to have improved rigidity in a specific region and excellent handleability without incurring optical losses during optical coupling.
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