Opto-electric hybrid module
    1.
    发明授权
    Opto-electric hybrid module 有权
    光电混合模块

    公开(公告)号:US09417384B2

    公开(公告)日:2016-08-16

    申请号:US14898547

    申请日:2014-05-07

    IPC分类号: G02B6/12

    摘要: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.

    摘要翻译: 提供了一种光电混合模块,其耐弯曲性和光学元件安装性优异。 在光电混合模块中,在下敷层的表面上设置有光波导路的光路芯,并且在光路芯的相对侧上设有非光路虚拟芯, 关于从下敷层的表面突出的光路芯。 具有安装焊盘的电路设置在虚拟芯的顶表面上。 在光路芯的侧表面和顶表面上设置上覆层,并突出覆盖芯。 非光路虚拟芯各自具有设定为高于下敷层的弹性模量和上敷层的弹性模量的弹性模量。 光学元件安装在安装焊盘上,并且位于突出的上敷层之上。

    OPTO-ELECTRIC HYBRID BOARD
    2.
    发明申请
    OPTO-ELECTRIC HYBRID BOARD 有权
    光电混合板

    公开(公告)号:US20140126857A1

    公开(公告)日:2014-05-08

    申请号:US13951633

    申请日:2013-07-26

    IPC分类号: G02B6/12

    摘要: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

    摘要翻译: 提供能够显着降低施加到其弯曲部分的应力的光电混合板。 光电混合基板包括堆叠电路板和光波导。 该电路板包括具有前表面和后表面的绝缘层,形成在绝缘层的前表面上的电互连线,以及形成在绝缘层的前表面上并用于覆盖和保护电互连线的绝缘覆盖层。 光波导包括具有前表面的第一包层,在第一包层的表面上以图案形成的芯和覆盖芯的第二包覆层。 光电混合板的一部分被定义为其中覆盖层和光波导以非重叠关系设置的弯曲部分。

    OPTO-ELECTRIC HYBRID BOARD
    3.
    发明申请
    OPTO-ELECTRIC HYBRID BOARD 有权
    光电混合板

    公开(公告)号:US20130259430A1

    公开(公告)日:2013-10-03

    申请号:US13785553

    申请日:2013-03-05

    IPC分类号: G02B6/36

    摘要: An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.

    摘要翻译: 光电混合基板包括:电路板,包括具有前表面和后表面的绝缘层,以及形成在绝缘层的前表面上的电互连线; 安装在电路板的表面上的光学元件,其上形成有电互连线; 以及包括芯并形成在电路板的绝缘层的背面上的光波导。 芯在其端部包括能够反射光束以在光纤和光学元件之间传播光束的反射表面。 绝缘层由透光材料制成。 与芯体的反射面和光学元件之间的光路对应的绝缘层的一部分为透镜部的形式。

    OPTO-ELECTRIC HYBRID MODULE
    5.
    发明申请
    OPTO-ELECTRIC HYBRID MODULE 有权
    OPTO-ELECTRIC混合模块

    公开(公告)号:US20160238807A1

    公开(公告)日:2016-08-18

    申请号:US15030184

    申请日:2014-08-18

    IPC分类号: G02B6/42 G02B6/122

    摘要: An opto-electric hybrid module is provided. In the opto-electric hybrid module, a core and an electric circuit including electric circuit body portions and mounting pads are provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted on the mounting pads with its electrodes in abutment against the mounting pads. The core is covered with the over-cladding layer, and a center portion of the optical element is positioned above a portion of the over-cladding layer covering a top surface of the core. A portion of the electric circuit excluding the mounting pads and a surface portion of the under-cladding layer present between the electric circuit body portions of the electric circuit and present between the electric circuit body portion and the mounting pad are covered with a core material layer formed of the same material as the core.

    摘要翻译: 提供光电混合模块。 在光电混合模块中,在光波导的下敷层的表面设置有包括电路体部和安装焊盘的芯和电路。 光学元件安装在安装焊盘上,其电极邻接安装焊盘。 该芯被上包层覆盖,并且光学元件的中心部分位于覆盖芯的顶表面的上覆层的一部分上方。 存在于电路的电路主体部分之间并且存在于电路主体部分和安装焊盘之间的电路的不包括安装焊盘的部分和下包层的表面部分被芯材层 由与核心相同的材料形成。

    OPTO-ELECTRIC HYBRID BOARD
    6.
    发明申请
    OPTO-ELECTRIC HYBRID BOARD 有权
    光电混合板

    公开(公告)号:US20160178839A1

    公开(公告)日:2016-06-23

    申请号:US14893245

    申请日:2014-03-31

    IPC分类号: G02B6/12 H05K1/02

    摘要: There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board in which electrical interconnect lines are formed on the front and back surfaces of an insulative layer having flexibility is used as an electric circuit board. A metal reinforcement layer is formed by plating on at least part of the electrical interconnect line on the back surface side which corresponds to a mounting pad on the front surface side. An optical waveguide is formed in contact with the electrical interconnect line on the back surface side of the flexible double-sided circuit board.

    摘要翻译: 提供了一种光电混合板,其中金属加强层与柔性电路板的绝缘层紧密接触而不插入粘合剂层,金属加强层允许元件的适当安装,同时由于 抑制在安装期间施加的压力负荷。 在光电混合电路板中,使用在具有柔性的绝缘层的前表面和后表面上形成电互连线的柔性双面电路板作为电路板。 金属加强层通过电镀在与表面侧上的安装焊盘相对应的背面侧上的电互连线的至少一部分上而形成。 形成与柔性双面电路板的背面侧的电气布线接触的光波导。

    Opto-electric hybrid board
    7.
    发明授权
    Opto-electric hybrid board 有权
    光电混合板

    公开(公告)号:US09335497B2

    公开(公告)日:2016-05-10

    申请号:US13785553

    申请日:2013-03-05

    IPC分类号: G02B6/42 H05K1/02 G02B6/43

    摘要: An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.

    摘要翻译: 光电混合基板包括:电路板,包括具有前表面和后表面的绝缘层,以及形成在绝缘层的前表面上的电互连线; 安装在电路板的表面上的光学元件,其上形成有电互连线; 以及包括芯并形成在电路板的绝缘层的背面上的光波导。 芯在其端部包括能够反射光束以在光纤和光学元件之间传播光束的反射表面。 绝缘层由透光材料制成。 与芯体的反射面和光学元件之间的光路对应的绝缘层的一部分为透镜部的形式。

    OPTO-ELECTRIC HYBRID BOARD
    8.
    发明申请

    公开(公告)号:US20190324200A1

    公开(公告)日:2019-10-24

    申请号:US16473799

    申请日:2017-11-28

    摘要: There is provided an opto-electric hybrid board with slight or no warpage. An opto-electric hybrid board according to the present disclosure includes an electric circuit board and an optical waveguide formed in a stacked manner on one surface of the electric circuit board. The optical waveguide includes an under cladding layer, cores for an optical path formed on a front surface of the under cladding layer, and over cladding layer formed on the front surface of the under cladding layer so as to cover the cores. A groove for prevention of warpage which has a bottom positioned below a top surface of the cores is formed at least in a front surface portion of the over cladding layer.

    OPTICAL CIRCUIT BOARD SHEET AND OPTO-ELECTRIC HYBRID BOARD SHEET INCLUDING SAME

    公开(公告)号:US20190150275A1

    公开(公告)日:2019-05-16

    申请号:US16098593

    申请日:2017-04-14

    IPC分类号: H05K1/02 G02B6/12 G02B6/122

    摘要: An optical circuit board sheet which has little or no warpage to have no cracking in cores, and an opto-electric hybrid board sheet including the same are provided. The optical circuit board sheet includes: an insulative sheet; an under cladding layer formed on a first surface of the insulative sheet; and at least one core formed on a surface of the under cladding layer. A hole is formed in a portion of the surface of the under cladding layer other than where the core is formed. The area percentage of an opening area of the hole is in the range of 5% to 99% with respect to the first surface of the insulative sheet.

    Opto-electric hybrid module
    10.
    发明授权

    公开(公告)号:US09686857B2

    公开(公告)日:2017-06-20

    申请号:US15030184

    申请日:2014-08-18

    摘要: An opto-electric hybrid module is provided. In the opto-electric hybrid module, a core and an electric circuit including electric circuit body portions and mounting pads are provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted on the mounting pads with its electrodes in abutment against the mounting pads. The core is covered with the over-cladding layer, and a center portion of the optical element is positioned above a portion of the over-cladding layer covering a top surface of the core. A portion of the electric circuit excluding the mounting pads and a surface portion of the under-cladding layer present between the electric circuit body portions of the electric circuit and present between the electric circuit body portion and the mounting pad are covered with a core material layer formed of the same material as the core.