公开(公告)号：US09831465B2

公开(公告)日：2017-11-28

申请号：US14901739

申请日：2014-06-30

Applicant: OSRAM OLED GmbH

Inventor： Richard Baisl ,  Christoph Kefes ,  Michael Popp

IPC: H01L51/52 ,  H01L51/44 ,  H01L51/56

CPC classification number: H01L51/5246 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/5212 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  Y02E10/549 ,  Y02P70/521

Abstract: A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

公开(公告)号：US20170018730A1

公开(公告)日：2017-01-19

申请号：US15211987

申请日：2016-07-15

Applicant: OSRAM OLED GmbH

Inventor： Michael Popp ,  Philipp Schwamb ,  Richard Baisl

IPC: H01L51/52

CPC classification number: H01L51/5228 ,  H01L27/3239 ,  H01L51/5212

Abstract: In at least one embodiment, an organic optoelectronic component, which is preferably an organic light emitting diode, includes a first electrode layer, a second electrode layer and an organic layer sequence situated between the electrode layers. Furthermore, the component includes a light-transmissive current confinement layer, which is fitted over the whole area between the first electrode layer and the organic layer sequence, such that the organic layer sequence is spaced apart from the first electrode layer. The current confinement layer is produced continuously from a common starting material and is structured by treatment and/or by action of temperature into at least one conductive region having a high electrical conductivity and into at least one insulating region having a low electrical conductivity. These electrical conductivities differ from one another by at least a factor of 10.

Abstract translation: 在至少一个实施例中，优选有机发光二极管的有机光电子部件包括位于电极层之间的第一电极层，第二电极层和有机层序列。 此外，该部件包括透光电流限制层，其被配置在第一电极层和有机层序列之间的整个区域上，使得有机层序列与第一电极层间隔开。 电流限制层是从共同的起始材料连续生产的，并且通过处理和/或通过温度的作用被结构化成具有高电导率的至少一个导电区域和至少一个具有低电导率的绝缘区域。 这些电导率相差至少10倍。

公开(公告)号：US09543541B1

公开(公告)日：2017-01-10

申请号：US14901743

申请日：2014-06-30

Applicant: OSRAM OLED GmbH

Inventor： Richard Baisl ,  Christoph Kefes ,  Michael Popp

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5243 ,  H01L24/83 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2224/83825 ,  H01L2251/301 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.

Abstract translation: 一种光电子部件的制造方法，其特征在于，在载体上形成包括功能层结构的光电子层结构，在所述光电子层结构上形成包含第一金属材料的框架结构，使得所述功能层结构以上的区域不含所述框 并且框架结构围绕该区域，在覆盖体上形成包括第二金属材料的粘合层，将液体第一合金施加到光电子层结构和/或该区域中的覆盖体的粘附层，耦合 所述覆盖体到所述光电子层结构，使得所述粘合层耦合到所述框架结构，并且所述液体第一合金与所述粘合层和所述框架结构直接接触，并且使所述第一合金的一部分与所述金属材料 框架结构和粘附层。

公开(公告)号：US20160372700A1

公开(公告)日：2016-12-22

申请号：US14901739

申请日：2014-06-30

Applicant: OSRAM OLED GMBH

Inventor： Richard Baisl ,  Christoph Kefes ,  Michael Popp

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5246 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/5212 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  Y02E10/549 ,  Y02P70/521

Abstract: A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

Abstract translation: 制造光电子部件的方法可以包括形成具有第一粘合层的光电子层结构，第一粘合层包括第一金属材料，在载体上方，提供具有第二粘合层的覆盖体，其包括第二金属材料， 第一合金与两个粘合层中的一个接合，第一合金的熔点低至第一合金为液体，将覆盖体与光电子层结构结合，使得两个粘合层都与 液态第一合金，并使至少一部分液体第一合金与金属材料化学反应，其结果是形成至少一种第二合金，其具有比第一合金更高的熔点，其中第二合金固化和 将覆盖体固定地连接到光电子层结构。