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1.发明申请公开(公告)号：US20170069876A1
公开(公告)日：2017-03-09
申请号：US15119135
申请日：2015-02-26
Applicant: OSRAM OLED GMBH
Inventor： Michael Popp , Richard Baisl , Christoph Kefes
CPC classification number: H01L51/5256 , H01L51/448 , H01L51/5203 , H01L51/56 , Y02E10/549 , Y02P70/521
Abstract: An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.
Abstract translation: 光电子部件可以包括载体，载体上的第一电极，第一电极上的有机功能层结构，有机功能层结构上的第二电极，以及在第二电极上的封装层结构，封装层结构封装 所述有机功能层结构包括面向所述第二电极的第一层结构和背离所述第二电极的第二层结构，所述第一层结构交替地包括具有第一膨胀系数的第一层和具有第二膨胀系数的第二层， 其不等于第一膨胀系数，并且第二层结构交替地包括具有第三膨胀系数的第三层和具有不等于第三膨胀系数的第四膨胀系数的第四层。
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Patent Agency Ranking
公开(公告)号：US10361396B2
公开(公告)日：2019-07-23
申请号：US15119135
申请日：2015-02-26
Applicant: OSRAM OLED GmbH
Inventor： Michael Popp , Richard Baisl , Christoph Kefes
Abstract: An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.
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公开(公告)号：US10756294B2
公开(公告)日：2020-08-25
申请号：US15311182
申请日：2015-04-15
Applicant: OSRAM OLED GmbH
Inventor： Michael Popp , Andrew Ingle , Christoph Kefes , Johannes Rosenberger , Stefan Dechand , Egbert Hoefling , Benjamin Claus Krummacher
Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.
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公开(公告)号：US09831465B2
公开(公告)日：2017-11-28
申请号：US14901739
申请日：2014-06-30
Applicant: OSRAM OLED GmbH
Inventor： Richard Baisl , Christoph Kefes , Michael Popp
CPC classification number: H01L51/5246 , H01L51/448 , H01L51/5203 , H01L51/5212 , H01L51/5243 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , Y02E10/549 , Y02P70/521
Abstract: A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.
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公开(公告)号：US09543541B1
公开(公告)日：2017-01-10
申请号：US14901743
申请日：2014-06-30
Applicant: OSRAM OLED GmbH
Inventor： Richard Baisl , Christoph Kefes , Michael Popp
CPC classification number: H01L51/5243 , H01L24/83 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L2224/83825 , H01L2251/301 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
Abstract: A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.
Abstract translation: 一种光电子部件的制造方法，其特征在于，在载体上形成包括功能层结构的光电子层结构，在所述光电子层结构上形成包含第一金属材料的框架结构，使得所述功能层结构以上的区域不含所述框 并且框架结构围绕该区域，在覆盖体上形成包括第二金属材料的粘合层，将液体第一合金施加到光电子层结构和/或该区域中的覆盖体的粘附层，耦合 所述覆盖体到所述光电子层结构，使得所述粘合层耦合到所述框架结构，并且所述液体第一合金与所述粘合层和所述框架结构直接接触，并且使所述第一合金的一部分与所述金属材料 框架结构和粘附层。
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公开(公告)号：US20160372700A1
公开(公告)日：2016-12-22
申请号：US14901739
申请日：2014-06-30
Applicant: OSRAM OLED GMBH
Inventor： Richard Baisl , Christoph Kefes , Michael Popp
CPC classification number: H01L51/5246 , H01L51/448 , H01L51/5203 , H01L51/5212 , H01L51/5243 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , Y02E10/549 , Y02P70/521
Abstract: A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.
Abstract translation: 制造光电子部件的方法可以包括形成具有第一粘合层的光电子层结构，第一粘合层包括第一金属材料，在载体上方，提供具有第二粘合层的覆盖体，其包括第二金属材料， 第一合金与两个粘合层中的一个接合，第一合金的熔点低至第一合金为液体，将覆盖体与光电子层结构结合，使得两个粘合层都与 液态第一合金，并使至少一部分液体第一合金与金属材料化学反应，其结果是形成至少一种第二合金，其具有比第一合金更高的熔点，其中第二合金固化和 将覆盖体固定地连接到光电子层结构。
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