Optical assemblies including dry adhesive layers and associated methods

    公开(公告)号:US09627559B2

    公开(公告)日:2017-04-18

    申请号:US14659596

    申请日:2015-03-16

    CPC classification number: H01L31/02325 H01L27/14625 H01L31/18 Y02P70/521

    Abstract: An optical assembly includes an image sensor, a lens module disposed over the image sensor in a first direction, a transparent glue layer, and a transparent dry adhesive layer formed of a different material than the transparent glue layer. Each of the transparent glue layer and the transparent dry adhesive layer are disposed between the image sensor and the lens module in the first direction. Each of the transparent glue layer and the transparent dry adhesive layer are optically coupled in series with the image sensor and the lens module. A method for forming an optical assembly includes joining an image sensor and a lens module using a transparent glue layer and a transparent dry adhesive layer formed of a different material than the transparent glue layer.

    Trenched-Substrate Based Lens Manufacturing Methods, And Associated Systems
    22.
    发明申请
    Trenched-Substrate Based Lens Manufacturing Methods, And Associated Systems 有权
    基于基底的透镜制造方法及相关系统

    公开(公告)号:US20160313540A1

    公开(公告)日:2016-10-27

    申请号:US14693014

    申请日:2015-04-22

    Abstract: A trenched-substrate based lens manufacturing method includes depositing lens material on a first side of a substrate, wherein the first side of the substrate has a plurality of trenches. The method further includes shaping a plurality of lens elements from the lens material. The method includes shaping the plurality of lens elements, on a respective plurality of surface portions of the first side, by contacting a mold to the first side. Each of the surface portions are adjacent a respective one of the trenches. Additionally, the method includes accommodating an excess portion of the lens material in the trenches. A lens system, manufactured using this method, includes a substrate with a planar surface and a trench embedded in the planar surface. The lens system further includes a lens element molded on the planar surface adjacent to the trench.

    Abstract translation: 基于沟槽衬底的透镜制造方法包括在衬底的第一侧上沉积透镜材料,其中衬底的第一侧具有多个沟槽。 该方法还包括从透镜材料成形多个透镜元件。 该方法包括在第一侧的相应多个表面部分上通过使模具与第一侧接触来成形多个透镜元件。 每个表面部分与相应的一个沟槽相邻。 此外,该方法包括将透镜材料的多余部分容纳在沟槽中。 使用该方法制造的透镜系统包括具有平坦表面的衬底和嵌入平面中的沟槽。 透镜系统还包括模制在与沟槽相邻的平面上的透镜元件。

    Wafer-Level Methods For Making Apertured Lenses And Associated Apertured Lens Systems
    23.
    发明申请
    Wafer-Level Methods For Making Apertured Lenses And Associated Apertured Lens Systems 有权
    用于制造光圈透镜和相关孔径透镜系统的晶片级方法

    公开(公告)号:US20160070089A1

    公开(公告)日:2016-03-10

    申请号:US14477258

    申请日:2014-09-04

    Abstract: A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.

    Abstract translation: 一种用于形成孔径晶圆的晶片级透镜形成方法,其中孔径晶片与一个或多个透镜晶片堆叠以形成有孔透镜系统。 孔径晶片通过在由基板支撑的透明膜上光刻沉积不透明层而形成。 孔径晶片与一个或多个透镜晶片堆叠,并且用间隔晶片设置晶片之间的适当间隔。 去除衬底,并且将透镜和孔径晶片以堆叠的方式粘合在一起以形成光学系统。 该方法避免了在不透明层沉积过程中残留物料在透镜上的积聚。 由于能够相对于独立于透镜晶片的一个或多个透镜定位孔径,所得到的光学系统受益于透镜系统设计的增加的灵活性。

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