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1.发明授权公开(公告)号：US10889078B2
公开(公告)日：2021-01-12
申请号：US14819103
申请日：2015-08-05
发明人： Tim Kao , Chia-Yang Chang , Livia Li
IPC分类号： B29D11/00 , B29C33/00 , B29C33/48 , B29K105/00
摘要： A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold from the optical spacer.
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公开(公告)号：US10187560B2
公开(公告)日：2019-01-22
申请号：US14884390
申请日：2015-10-15
发明人： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC分类号： H04N5/225
摘要： A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
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3.发明申请Apparatus And Method For Molding Optical Lense During A Puddle Dispensing Process 有权在水坑分配过程中模制光学透镜的装置和方法公开(公告)号：US20150077856A1
公开(公告)日：2015-03-19
申请号：US14028076
申请日：2013-09-16
发明人： Huiyan Neo , Regis Sh-Louen Fan , Chia-Yang Chang
CPC分类号： G02B3/0037 , B29C33/42 , B29C39/026 , B29D11/00298 , B29D11/0048 , B29L2011/0016 , G02B3/0031
摘要： An optical mold including a spacer cavity portion, a lens cavity portion and a flow stop control portion for allowing optical lens material to flow between the spacer cavity portion and the lens cavity portion and an optical lens array formed therefrom. The optical mold may further include a pedestal located within the spacer cavity portion for supporting the mold during a puddle dispensing process. A method for using the optical mold including the spacer cavity portion, the lens cavity portion, and the flow cavity portion, and optionally the pedestal.
摘要翻译： 一种光学模具，包括间隔空腔部分，透镜腔部分和用于允许光学透镜材料在间隔空腔部分和透镜腔部分之间流动的流动停止控制部分和由其形成的光学透镜阵列。 光学模具还可以包括位于间隔空腔部分内的基座，用于在熔池分配过程期间支撑模具。 一种使用包括间隔件空腔部分，透镜腔部分和流动空腔部分的光学模具以及可选的底座的方法。
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公开(公告)号：US10459189B2
公开(公告)日：2019-10-29
申请号：US15286300
申请日：2016-10-05
发明人： Chia-Yang Chang , Teng-Sheng Chen
摘要： A method for forming a lens barrel includes aligning each of a plurality of upper apertures of an upper wafer to (i) a respective one of a plurality of middle apertures of a middle wafer and (ii) a respective one of a plurality of lower apertures of a lower wafer. The middle wafer is between the upper wafer and the lower wafer. The method also includes bonding the middle wafer to the upper wafer to form a lens barrel wafer. Each triad of co-aligned upper, middle, and lower apertures forms a wafer aperture spanning between a top surface of the upper wafer and a bottom surface of the lower wafer. Each upper aperture has a respective upper width and each middle aperture has a respective middle width less than the respective upper width to form, in each triad, a ledge for supporting a lens in the upper aperture.
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公开(公告)号：US20170213864A1
公开(公告)日：2017-07-27
申请号：US15004584
申请日：2016-01-22
IPC分类号： H01L27/146 , H01L23/544
CPC分类号： H01L27/14618 , H01L23/544 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L2223/5442 , H01L2223/54426 , H01L2223/5446 , H01L2223/5448 , H01L2223/54486 , H01L2224/11
摘要： Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.
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公开(公告)号：US20180095193A1
公开(公告)日：2018-04-05
申请号：US15282095
申请日：2016-09-30
发明人： Mao-Chin Wang , Chia-Yang Chang , Shao-Fan Kao
CPC分类号： G02B3/0056 , B29D11/00307 , B29D11/00365 , B29D11/00442 , B29D11/0048 , B29K2995/0025 , B29K2995/0026 , G02B3/0031 , G02B3/005 , G02B13/0085
摘要： A wafer-level method for manufacturing yardless lenses includes (a) depositing light-curable lens resin between a mold and a first side of a transparent substrate, wherein the first side of the transparent substrate has an opaque coating with a plurality of apertures respectively aligned with a plurality of lens-shaped recesses of the mold, and (b) exposing a second side of the transparent substrate, facing away from the first side, to light, thereby illuminating portions of the light-curable lens resin aligned with the plurality of apertures to form a respective plurality of yardless lenses.
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公开(公告)号：US09921393B2
公开(公告)日：2018-03-20
申请号：US14477258
申请日：2014-09-04
发明人： Min Ching Kao , Chia-Yang Chang
IPC分类号： G02B13/14 , B32B38/00 , B32B38/10 , B32B37/24 , B32B37/12 , G02B13/00 , G02B5/00 , B29D11/00
CPC分类号： G02B13/0085 , B29D11/00307 , B32B37/24 , B32B38/10 , B32B2037/243 , B32B2307/412 , B32B2551/00 , G02B5/005
摘要： A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.
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公开(公告)号：US20170111560A1
公开(公告)日：2017-04-20
申请号：US14884390
申请日：2015-10-15
发明人： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H04N5/2253
摘要： A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
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9.发明申请Optical Spacer Including Controlled Located Aperture and Method of Manufacturing The Same 审中-公开包括受控孔径的光学间隔及其制造方法公开(公告)号：US20170036407A1
公开(公告)日：2017-02-09
申请号：US14819103
申请日：2015-08-05
发明人： Tim Kao , Chia-Yang Chang , Livia LI
IPC分类号： B29D11/00
CPC分类号： B29D11/00365 , B29D11/00298 , B29K2105/0058 , B29K2105/0097
摘要： A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold from the optical spacer.
摘要翻译： 制造光学间隔物的方法包括：在模具内分配热胶; 使用光学间隔基板按压热胶以产生包括孔的光学间隔物; 并且从光学间隔件释放模具。 在从光学间隔物释放模具之前，可以固化热胶。
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公开(公告)号：US20190181179A1
公开(公告)日：2019-06-13
申请号：US16267370
申请日：2019-02-04
发明人： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC分类号： H01L27/146
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14687
摘要： A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
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