公开(公告)号：US09921393B2

公开(公告)日：2018-03-20

申请号：US14477258

申请日：2014-09-04

Applicant: OmniVision Technologies, Inc.

Inventor： Min Ching Kao ,  Chia-Yang Chang

IPC: G02B13/14 ,  B32B38/00 ,  B32B38/10 ,  B32B37/24 ,  B32B37/12 ,  G02B13/00 ,  G02B5/00 ,  B29D11/00

CPC classification number: G02B13/0085 ,  B29D11/00307 ,  B32B37/24 ,  B32B38/10 ,  B32B2037/243 ,  B32B2307/412 ,  B32B2551/00 ,  G02B5/005

Abstract: A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.

公开(公告)号：US20160070089A1

公开(公告)日：2016-03-10

申请号：US14477258

申请日：2014-09-04

Applicant: OmniVision Technologies, Inc.

Inventor： Min Ching Kao ,  Chia-Yang Chang

IPC: G02B13/14 ,  B32B38/00 ,  B32B38/10 ,  B32B37/24 ,  B32B37/12

CPC classification number: G02B13/0085 ,  B29D11/00307 ,  B32B37/24 ,  B32B38/10 ,  B32B2037/243 ,  B32B2307/412 ,  B32B2551/00 ,  G02B5/005

Abstract: A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.

Abstract translation: 一种用于形成孔径晶圆的晶片级透镜形成方法，其中孔径晶片与一个或多个透镜晶片堆叠以形成有孔透镜系统。 孔径晶片通过在由基板支撑的透明膜上光刻沉积不透明层而形成。 孔径晶片与一个或多个透镜晶片堆叠，并且用间隔晶片设置晶片之间的适当间隔。 去除衬底，并且将透镜和孔径晶片以堆叠的方式粘合在一起以形成光学系统。 该方法避免了在不透明层沉积过程中残留物料在透镜上的积聚。 由于能够相对于独立于透镜晶片的一个或多个透镜定位孔径，所得到的光学系统受益于透镜系统设计的增加的灵活性。