摘要:
A thermal actuator comprises a plurality of substantially straight and parallel beams arranged to form a beam array. The midpoint of each beam is attached or coupled to an orthogonal coupling beam. Each array beam has a beam heating parameter with a corresponding beam heating parameter value. The beam heating parameter values vary across the beam array based on a predetermined pattern. As the beams are heated by an included heating means, the distribution of beam temperatures in the beam array becomes asymmetric, thus causing the beam array to buckle. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to move in a predetermined direction. The coupling beam motion, in turn, operates an included optical waveguide switch. The beams in the beam array are heated by any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.
摘要:
Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more tapered nozzles each with an associated taper angle and exit diameter. Ink can be received into the printhead and formed into ink drops in the tapered nozzles. The ink drops can each have an associated drop mass and drop speed. The tapered nozzles can be provided such that the exit diameter can independently dictate the drop mass and the taper angle can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.
摘要:
A thermal bubble jetting device including a substrate. A superoleophobic, textured surface is positioned on the substrate. The textured surface comprises one or more gaps configured for holding a gas. A receptacle is positioned in fluid communication with the textured surface. Both an inlet and nozzle are in fluid communication with the receptacle. The device includes a heater mechanism configured to expand a gas in the one or more gaps so as to sufficiently increase pressure in the receptacle to force liquid through the nozzle.
摘要:
A method and structure for an ink jet printhead aperture plate assembly which can be part of an ink jet printhead and an ink jet printer. The present teachings can include the use of a protective coverlay interposed between a press plate of a press and an anti-wetting coating on a polyimide layer which forms part of the aperture plate assembly. The coverlay can include a base material which has an elastic modulus which is at least a specified value. An embodiment of the present teachings can form an aperture plate assembly and an ink jet printhead having reduced dimpling and deformation around a nozzle opening in the aperture plate assembly.
摘要:
A chip used for dispensing a fluid such as ink provides ink-dispensing ejectors having an ink cavity over a supporting substrate, and further provides a heater for heating the ink in the cavity. The heater can be interposed between the substrate and the ink cavity to provide direct heating of ink as it is being dispensed. Various embodiments further comprise the use of the heater structure as a temperature probe to measure the temperature of the ink in the ink cavity. Other embodiments provides a chip having both a temperature probe and a heater as separate structures interposed between the ink cavity and the substrate. Further described is a temperature probe and/or heater which traverses a majority of a width of a substrate, and surrounds each drop ejector on at least two sides.
摘要:
Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more tapered nozzles each with an associated taper angle and exit diameter. Ink can be received into the printhead and formed into ink drops in the tapered nozzles. The ink drops can each have an associated drop mass and drop speed. The tapered nozzles can be provided such that the exit diameter can independently dictate the drop mass and the taper angle can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.
摘要:
A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要:
A printhead manufacturing method includes providing a first wafer, forming a polymer layer over the first wafer, the polymer layer including at least one via, providing a metal layer over the at least one via, providing a solderable or plateable interface layer over the metal layer and the polymer layer, forming a fluid chamber in the polymer layer, providing a fluid nozzle in the first wafer, providing a second wafer, and joining the second wafer to the first layer to form the printhead. A printhead that includes a first wafer, a polymer layer over the first wafer, the polymer layer including at least one via, a metal layer over the at least one via, an interface layer over the metal layer and the polymer layer, a fluid chamber formed in the polymer layer, and a fluid chamber formed in the first wafer.
摘要:
A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要:
A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.