公开(公告)号：US20110127845A1

公开(公告)日：2011-06-02

申请号：US12793551

申请日：2010-06-03

申请人： John Walley ,  Jeyhan Karaoguz ,  Ahmadreza (Reza) Rofougaran ,  Nambirajan Seshadri ,  Reinier Van Der Lee

发明人： John Walley ,  Jeyhan Karaoguz ,  Ahmadreza (Reza) Rofougaran ,  Nambirajan Seshadri ,  Reinier Van Der Lee

IPC分类号： H02J17/00

CPC分类号： H02J50/12 ,  H02J5/005 ,  H02J7/025 ,  H02J50/40 ,  H02J50/80 ,  H04B5/0037

摘要： A circuit board assembly includes a multiple layer substrate, a wireless power transmitter control module, a wireless power coil assembly, and a plurality of ICs. The wireless power transmitter control module is supported by a layer of the multiple layer substrate and the wireless power coil assembly is fabricated on an inner layer of the multiple layer substrate. The ICs are mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is aligned to substantially overlap a coil of the wireless power coil assembly and is wirelessly powered by the wireless power transmitter control module via the coil.

摘要翻译： 电路板组件包括多层衬底，无线功率发射器控制模块，无线电力线圈组件和多个IC。 无线功率发射器控制模块由多层基板的层支撑，无线电力线圈组件制造在多层基板的内层上。 所述IC安装在所述多层基板的外层上，其中所述多个IC中的IC被对准以与所述无线电力线圈组件的线圈基本重叠，并且通过所述线圈由所述无线电力变送器控制模块进行无线供电。

公开(公告)号：US20110127844A1

公开(公告)日：2011-06-02

申请号：US12793491

申请日：2010-06-03

申请人： John Walley ,  Jeyhan Karaoguz ,  Ahmadreza (Reza) Rofougaran ,  Nambirajan Seshadri ,  Reinier Van Der Lee

发明人： John Walley ,  Jeyhan Karaoguz ,  Ahmadreza (Reza) Rofougaran ,  Nambirajan Seshadri ,  Reinier Van Der Lee

IPC分类号： H02J17/00

CPC分类号： H04B5/0037 ,  G06K7/10207 ,  G06K7/10346 ,  G06K19/0701 ,  G06K19/0715 ,  G06K19/0723 ,  H02J17/00 ,  H02J50/12 ,  H02J50/80 ,  H04L29/06163 ,  H04L69/18

摘要： A low pin count IC includes a wireless power receive coil, a rectifying circuit, an output circuit, circuit modules, a power management unit (PMU), a die, and a package substrate. The wireless power receive coil generates an AC voltage from a wireless power electromagnetic signal and the rectifying circuit generates a rectified voltage from the AC voltage. The output circuit generates a DC voltage from the rectified voltage. The PMU manages distribution of the DC voltage to the circuit modules. The die supports the circuit modules and the PMU, wherein the die includes return pads for coupling to circuit return nodes and a PMU return node. The package substrate supports the die and includes return pins for coupling to the return pads, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit.

摘要翻译： 低引脚数IC包括无线电力接收线圈，整流电路，输出电路，电路模块，电源管理单元（PMU），管芯和封装衬底。 无线电力接收线圈从无线电力电磁信号产生交流电压，整流电路从交流电压产生整流电压。 输出电路从整流电压产生直流电压。 PMU管理直流电压到电路模块的分配。 芯片支持电路模块和PMU，其中芯片包括用于耦合到电路返回节点的返回焊盘和PMU返回节点。 封装衬底支撑裸片并且包括用于耦合到返回焊盘的返回引脚，其中管芯和封装衬底中的至少一个支撑无线电力接收线圈，整流电路和输出电路。