公开(公告)号：US20140284650A1

公开(公告)日：2014-09-25

申请号：US14355521

申请日：2012-10-09

Applicant: Seoul Viosys Co., Ltd.

Inventor： Hee Cheul Jung ,  Jung Hye Chae ,  Bo Ram I Jang ,  Jun Yong Park ,  Dae Woong Suh

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

Abstract translation: 公开了一种发光二极管封装及其制造方法。 制造发光二极管封装的方法包括：制备具有空腔的封装主体和从空腔延伸的排气通道; 在封装主体的腔体内安装发光二极管; 通过粘合剂附接透明构件以覆盖空腔的上部; 并且通过形成密封构件来堵塞排气通道。 在安装透明构件之后，当排气通道被阻塞时，可以防止透明构件从空腔内的空气压力中剥离。