公开(公告)号：US12132158B2

公开(公告)日：2024-10-29

申请号：US17432429

申请日：2020-02-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Richard Scheicher ,  Thomas Huettmayer ,  Ivar Tangring ,  Angela Eberhardt ,  Florian Peskoller

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/22 ,  H01L33/44 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/22 ,  H01L33/44 ,  H01L33/58 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: In an embodiment an optoelectronic component includes a first joining partner including an LED chip with a structured light-emitting surface and a compensation layer applied to the light-emitting surface, wherein the compensation layer has a surface facing away from the light-emitting surface and spaced apart from the light-emitting surface, and wherein the surface forms a first connecting surface, a second joining partner having a second connecting surface, the first and second connecting surfaces being arranged such that they face each other and a bonding layer made of a film of low-melting glass having a layer thickness of not more than 1 μm, wherein the bonding layer bonds the first and second connecting surfaces together, wherein the structure of the light-emitting surface is embedded in the compensation layer, and wherein the first and second connecting surfaces are smooth such that their surface roughness, expressed as center-line roughness, is less than or equal to 50 nm.

公开(公告)号：US20240347517A1

公开(公告)日：2024-10-17

申请号：US18678845

申请日：2024-05-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Min JANG ,  Chang Youn KIM

IPC: H01L25/075 ,  H01L33/08 ,  H01L33/38 ,  H01L33/44 ,  H01L33/60

CPC classification number: H01L25/0753 ,  H01L33/08 ,  H01L33/382 ,  H01L33/385 ,  H01L33/387 ,  H01L33/44 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.

公开(公告)号：US20240347368A1

公开(公告)日：2024-10-17

申请号：US18756658

申请日：2024-06-27

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: Embodiments disclose methods of transferring selected microdevices on a receiver substrate. In one embodiment, a high resolution display comprising a light emitting device (LED) array may be provided to assist in transferring the microdevices. The LED array can selectively either release a layer by using light or cure a bonding layer. The pixels in the display can be turned on corresponding to a set of selected microdevices with predefined intensities to release the set of selected microdevices from the donor substrate.

公开(公告)号：US12119434B2

公开(公告)日：2024-10-15

申请号：US18358657

申请日：2023-07-25

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.

公开(公告)号：US12111537B2

公开(公告)日：2024-10-08

申请号：US18418899

申请日：2024-01-22

Applicant: Sharp Display Technology Corporation

Inventor： Takeshi Masuda ,  Hisashi Watanabe ,  Hirotoshi Yasunaga

IPC: G02F1/13357 ,  G02F1/1335 ,  H01L25/075 ,  H01L33/00 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60

CPC classification number: G02F1/133605 ,  G02F1/133603 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/60 ,  H01L2933/0058

Abstract: A lighting device includes a substrate, a first conductive portion, a second conductive portion disposed with a spacing as to the first conductive portion, a first reflective layer having a first opening coinciding with the first conductive portion and a second opening coinciding with the second conductive portion, a light-emitting part connected to the first conductive portion through the first opening, a non-light-emitting part connected to the second conductive portion through the second opening, and a second reflective layer. The second reflective layer includes a first reflective portion disposed around the light-emitting part, and a second reflective portion disposed around the non-light-emitting part.

公开(公告)号：US12100786B2

公开(公告)日：2024-09-24

申请号：US17341743

申请日：2021-06-08

Applicant: LUMILEDS LLC

Inventor： Grigoriy Basin ,  Lex Alan Kosowsky ,  Chee Ming Thoe ,  Choon Earn Chan

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/501 ,  H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

公开(公告)号：US20240313181A1

公开(公告)日：2024-09-19

申请号：US18536238

申请日：2023-12-12

Applicant: AUO Corporation

Inventor： Yi-Yueh Hsu ,  Kuan-Hsun Chen ,  Sheng-Chin Wang

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A display panel having a display region and a lead out wiring region adjacent to each other is provided. The display panel includes a circuit substrate, light-emitting elements disposed at the display region and located on the circuit substrate, an encapsulation layer, and a sealing layer. The circuit substrate has opposite top and bottom surfaces and a first side surface connecting the top and bottom surfaces and extending from the display region to the lead out wiring region. The encapsulation layer is disposed at the display region and located between the circuit substrate and the light-emitting elements, where a first terminal surface of the encapsulation layer is aligned with the first side surface of the circuit substrate. The sealing layer covers the first side surface and the first terminal surface. A tiled display device including the above-mentioned display panel and a manufacturing method of the display panel are also provided.

公开(公告)号：US12087890B2

公开(公告)日：2024-09-10

申请号：US17565443

申请日：2021-12-29

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/505 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L25/0753 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A light emitting device includes a light emitting element, a light-transmissive member, a bonding member and a light-reflective member. The bonding member is disposed between the light emitting element and the light-transmissive member, with the bonding member covering an upper surface of the light emitting element and at least a part of a lateral surface of the light emitting element. The light-reflective member covers the bonding member and a lateral surface of the light-transmissive member. The bonding member includes a surface that is flush with the lateral surface of the light-transmissive member, and an inclined surface that is inclined so as to extend toward the light-transmissive member.

公开(公告)号：US12087741B2

公开(公告)日：2024-09-10

申请号：US17055206

申请日：2019-05-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Koji Kusunoki ,  Yosuke Tsukamoto ,  Kensuke Yoshizumi

IPC: H01L25/075 ,  H01L27/12 ,  H01L29/786 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L27/1225 ,  H01L29/78651 ,  H01L29/7869 ,  H01L33/504 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display device with a high luminance, a high contrast, and low power consumption is provided. The display device includes a transistor, a light-emitting element, a coloring layer, a phosphor layer, a first electrode, and a second electrode. The light-emitting element is electrically connected to the first electrode and the second electrode, the first electrode is electrically connected to the transistor, and the second electrode is positioned on the same plane as the first electrode. The coloring layer is positioned over the light-emitting element, the phosphor layer is positioned between the light-emitting element and the coloring layer, and the phosphor layer, the light-emitting element, and the coloring layer include a region in which they overlap with one another. The light-emitting element includes a light-emitting diode chip, and the phosphor layer has a function of emitting light of a complementary color of an emission color of the light-emitting element.

公开(公告)号：US12080835B2

公开(公告)日：2024-09-03

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.