公开(公告)号：US20150055311A1

公开(公告)日：2015-02-26

申请号：US13972271

申请日：2013-08-21

Applicant: SUMIDA Corporation

Inventor： Mitsugu KAWARAI ,  Douglas James MALCOLM

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0215 ,  H05K1/0233 ,  H05K1/09 ,  H05K1/181 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/086 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49146

Abstract: An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture.

Abstract translation: 电子部件包括电路基板，其包括与接地电位相连的接地端子，组装在电路基板上的线圈部件，线圈部件包括T字形芯和空心线圈，接地连接电极， 组装在与线圈部件相邻的电路板上，并且与接地端子连接，并且形成在电路板上并覆盖线圈部件和接地连接电极的金属复合磁性材料和树脂的混合物 作为一个包装。 接地连接电极的一部分露出混合物外。