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    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
    2.
    发明申请
    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL 审中-公开

    公开(公告)号：US20200098515A1

    公开(公告)日：2020-03-26

    申请号：US16698609

    申请日：2019-11-27

    Applicant: SUMIDA CORPORATION

    Inventor： Shinichi SAKAMOTO ,  Douglas James MALCOLM

    IPC: H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

    Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.

    ELECTRONIC COMPONENT WITH COIL, METHOD FOR MANUFACTURING THE SAME AND POWER SUPPLY MODULE
    3.
    发明申请
    ELECTRONIC COMPONENT WITH COIL, METHOD FOR MANUFACTURING THE SAME AND POWER SUPPLY MODULE 有权
    带线圈的电子元件，其制造方法和电源模块

    公开(公告)号：US20150055311A1

    公开(公告)日：2015-02-26

    申请号：US13972271

    申请日：2013-08-21

    Applicant: SUMIDA Corporation

    Inventor： Mitsugu KAWARAI ,  Douglas James MALCOLM

    IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/30

    CPC classification number: H05K1/0215 ,  H05K1/0233 ,  H05K1/09 ,  H05K1/181 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/086 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49146

    Abstract: An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture.

    Abstract translation: 电子部件包括电路基板，其包括与接地电位相连的接地端子，组装在电路基板上的线圈部件，线圈部件包括T字形芯和空心线圈，接地连接电极， 组装在与线圈部件相邻的电路板上，并且与接地端子连接，并且形成在电路板上并覆盖线圈部件和接地连接电极的金属复合磁性材料和树脂的混合物 作为一个包装。 接地连接电极的一部分露出混合物外。

    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
    4.
    发明申请
    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL 有权
    用线圈制造电子元件的方法

    公开(公告)号：US20140259640A1

    公开(公告)日：2014-09-18

    申请号：US13804857

    申请日：2013-03-14

    Applicant: SUMIDA CORPORATION

    Inventor： Shinichi SAKAMOTO ,  Douglas James MALCOLM

    IPC: H01F41/06

    CPC classification number: H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

    Abstract translation: 一种用于制造用于避免电磁干扰的电子部件的方法包括：（a）将T形芯和空芯线圈放置在金属模具中; （b）将复合磁性材料和树脂的混合物注入到金属模具中，使得T型芯和空芯线圈被混合物嵌入; （c）在第一温度下加热混合物; （d）调整外形同时去除过量的混合物; 和（e）硬化混合物。 该方法还可以包括抛光硬化混合物的外部的过程。 该方法可以进一步包括向混合物施加0.1至20.0kg / cm2的压力以在硬化过程之前通过冲压机的活动冲头调节混合物的外形的工艺。

    Method For Manufacturing Electronic Component With Coil
    8.
    发明申请
    Method For Manufacturing Electronic Component With Coil 有权

    公开(公告)号：US20220013285A1

    公开(公告)日：2022-01-13

    申请号：US17483852

    申请日：2021-09-24

    Applicant: SUMIDA CORPORATION

    Inventor： Shinichi SAKAMOTO ,  Douglas James MALCOLM

    IPC: H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

    Abstract: An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.

    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
    10.
    发明申请
    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL 审中-公开
    用线圈制造电子元件的方法

    公开(公告)号：US20150270064A1

    公开(公告)日：2015-09-24

    申请号：US14734004

    申请日：2015-06-09

    Applicant: SUMIDA Corporation

    Inventor： Shinichi SAKAMOTO ,  Douglas James MALCOLM

    IPC: H01F41/06 ,  H01F27/28 ,  H01F27/24

    CPC classification number: H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

    Abstract translation: 一种用于制造用于避免电磁干扰的电子部件的方法包括：（a）将T形芯和空芯线圈放置在金属模具中; （b）将复合磁性材料和树脂的混合物注入到金属模具中，使得T型芯和空芯线圈被混合物嵌入; （c）在第一温度下加热混合物; （d）调整外形同时去除过量的混合物; 和（e）硬化混合物。 该方法还可以包括抛光硬化混合物的外部的过程。 该方法可以进一步包括向混合物施加0.1至20.0kg / cm2的压力以在硬化过程之前通过冲压机的活动冲头调节混合物的外形的工艺。

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