Semiconductor device having stressor and method of forming the same
    21.
    发明授权
    Semiconductor device having stressor and method of forming the same 有权
    具有应力源的半导体器件及其形成方法

    公开(公告)号:US09577097B2

    公开(公告)日:2017-02-21

    申请号:US14806782

    申请日:2015-07-23

    Inventor: Jaehoon Lee

    Abstract: A semiconductor device having a stressor is provided. A first trench and a second trench spaced apart from each other are formed in a substrate. A channel area is defined between the first trench and the second trench. A gate dielectric layer is formed on the channel area. A gate electrode is formed on the gate dielectric layer. The stressor includes a plurality of semiconductor layers formed in the first trench and the second trench and a plurality of interlayers formed between the semiconductor layers. Sidewalls of the first trench and the second trench are v-shaped (e.g., have a shape).

    Abstract translation: 提供了具有应力源的半导体器件。 在衬底中形成彼此间隔开的第一沟槽和第二沟槽。 在第一沟槽和第二沟槽之间限定沟道区域。 栅极电介质层形成在沟道区上。 在栅极电介质层上形成栅电极。 应力器包括形成在第一沟槽和第二沟槽中的多个半导体层以及形成在半导体层之间的多个中间层。 第一沟槽和第二沟槽的侧壁是v形的(例如,具有<或>形状)。

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