公开(公告)号：US20130015559A1

公开(公告)日：2013-01-17

申请号：US13546415

申请日：2012-07-11

申请人： Sung-Ho LEE ,  Jin Choi ,  Yong-Ho Yoo ,  Jong-Hyuk Kang ,  Hyun-Joo Cha ,  Hee-Dong Park ,  Tae-Jung Park

发明人： Sung-Ho LEE ,  Jin Choi ,  Yong-Ho Yoo ,  Jong-Hyuk Kang ,  Hyun-Joo Cha ,  Hee-Dong Park ,  Tae-Jung Park

IPC分类号： H01L27/08 ,  H01L21/82

CPC分类号： H01L28/91 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/60

摘要： A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.

摘要翻译： 半导体器件包括在基片上的多个下电极，其中每个下电极从衬底沿高度方向延伸并且包括侧壁，下电极在第一方向和第二方向彼此间隔开， 与下电极的侧壁接触的多个第一支撑层图案，第一支撑层图案沿着第一方向在第二方向上相邻的下电极之间延伸;多个第二支撑层图案，其与下部电极的侧壁接触; 电极，所述第二支撑层图案沿着所述第二方向在与所述第一方向相邻的所述下电极中的所述第二方向延伸，所述多个第二支撑层图案在所述高度方向上与所述多个第一支撑层图案间隔开。

公开(公告)号：US20110253121A1

公开(公告)日：2011-10-20

申请号：US13141471

申请日：2009-12-23

申请人： Hee-Dong Park ,  Nam-Kwang Kim

发明人： Hee-Dong Park ,  Nam-Kwang Kim

IPC分类号： B28D1/06 ,  B32B3/30

CPC分类号： B28D1/06 ,  Y10T428/2457

摘要： There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

摘要翻译： 提供了一种使用框架锯锯切割或钻孔工件的方法，包括大理石和花岗岩，砖，混凝土和沥青等石材。 提供由框架组合锯切割的工件，其包括具有多个切割尖端的一个或多个叶片，或包括不包括切割尖端的叶片; 通过使用框架锯切割工件的方法; 和通过切割方法提供的产品。 工件被设置为包括一个或多个凹槽，多个切割尖端中的至少一个切割尖端的至少一部分或没有切割尖端的至少一部分刀片被插入到该凹槽中，并且其形成在其中。 这里，可以缩短工件上的初始切割时间，以通过显着降低叶片的偏转力来改善框架组合锯片的生产率和产品的质量以及寿命。