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公开(公告)号：US09054226B2
公开(公告)日：2015-06-09
申请号：US13546415
申请日：2012-07-11
申请人： Sung-Ho Lee , Jin Choi , Yong-Ho Yoo , Jong-Hyuk Kang , Hyun-Joo Cha , Hee-Dong Park , Tae-Jung Park
发明人： Sung-Ho Lee , Jin Choi , Yong-Ho Yoo , Jong-Hyuk Kang , Hyun-Joo Cha , Hee-Dong Park , Tae-Jung Park
IPC分类号： H01L27/108 , H01L49/02
CPC分类号： H01L28/91 , H01L27/10817 , H01L27/10852 , H01L28/60
摘要： A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.
摘要翻译： 半导体器件包括在基片上的多个下电极，其中每个下电极从衬底沿高度方向延伸并且包括侧壁，下电极在第一方向和第二方向彼此间隔开， 与下电极的侧壁接触的多个第一支撑层图案，第一支撑层图案沿着第一方向在第二方向上相邻的下电极之间延伸;多个第二支撑层图案，其与下部电极的侧壁接触; 电极，所述第二支撑层图案沿着所述第二方向在与所述第一方向相邻的所述下电极中的所述第二方向延伸，所述多个第二支撑层图案在所述高度方向上与所述多个第一支撑层图案间隔开。
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公开(公告)号：US20130015559A1
公开(公告)日：2013-01-17
申请号：US13546415
申请日：2012-07-11
申请人： Sung-Ho LEE , Jin Choi , Yong-Ho Yoo , Jong-Hyuk Kang , Hyun-Joo Cha , Hee-Dong Park , Tae-Jung Park
发明人： Sung-Ho LEE , Jin Choi , Yong-Ho Yoo , Jong-Hyuk Kang , Hyun-Joo Cha , Hee-Dong Park , Tae-Jung Park
CPC分类号： H01L28/91 , H01L27/10817 , H01L27/10852 , H01L28/60
摘要： A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.
摘要翻译： 半导体器件包括在基片上的多个下电极，其中每个下电极从衬底沿高度方向延伸并且包括侧壁，下电极在第一方向和第二方向彼此间隔开， 与下电极的侧壁接触的多个第一支撑层图案，第一支撑层图案沿着第一方向在第二方向上相邻的下电极之间延伸;多个第二支撑层图案，其与下部电极的侧壁接触; 电极，所述第二支撑层图案沿着所述第二方向在与所述第一方向相邻的所述下电极中的所述第二方向延伸，所述多个第二支撑层图案在所述高度方向上与所述多个第一支撑层图案间隔开。
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公开(公告)号：US08656901B2
公开(公告)日：2014-02-25
申请号：US12281004
申请日：2007-02-28
申请人： Soo-Kwang Kim , Hee-Dong Park , Nam-Kwang Kim
发明人： Soo-Kwang Kim , Hee-Dong Park , Nam-Kwang Kim
IPC分类号： B28D1/12
CPC分类号： B28D1/127 , B24D99/005
摘要： A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
摘要翻译： 公开了一种用于切割或钻出诸如石头，砖，混凝土或沥青的脆性工件的切割工具的切割尖端和设置有切割尖端的框架锯。 包括磨料颗粒的摆动式切割尖端具有能够提高磨料颗粒的切割效率的特定布置，从而实现切割性能的提高和寿命的增加。 切割尖端包括多个磨料颗粒以在摆动时切割工件。 研磨颗粒的至少一部分以研磨颗粒组的形式排列。 每个研磨颗粒组由至少两个研磨颗粒构成。 研磨颗粒组的研磨颗粒的至少一部分在切割方向上重叠。
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公开(公告)号：US07557133B2
公开(公告)日：2009-07-07
申请号：US10568503
申请日：2004-08-26
申请人： Hye-Kyung Chang , Yeong-Soo Oh , Cheol-Won Park , Yong-Jin Jang , Tae-Kyo Park , Sung-Sub Kim , Min-Jung Kim , Mi-Jeong Park , Jung-Gyu Park , Hee-Dong Park , Kyeong-Sik Min , Tae-Soo Lee , Sang-Kyun Lee , Soo-Hyeon Kim , Hee-Kyung Jeong , Sun-Hwa Lee , Hwa-Dong Kim , Ae-Ri Kim , Ki-Sook Park , Hyun-Ik Shin , Hyeong-Wook Choi , Kyu-Woong Lee , Jae-Hoon Lee , Tae-Ho Heo , Ho-Jun Kim , Tae-Sik Kwon , Jeong Hui Seong
发明人： Hye-Kyung Chang , Yeong-Soo Oh , Cheol-Won Park , Yong-Jin Jang , Tae-Kyo Park , Sung-Sub Kim , Min-Jung Kim , Mi-Jeong Park , Jung-Gyu Park , Hee-Dong Park , Kyeong-Sik Min , Tae-Soo Lee , Sang-Kyun Lee , Soo-Hyeon Kim , Hee-Kyung Jeong , Sun-Hwa Lee , Hwa-Dong Kim , Ae-Ri Kim , Ki-Sook Park , Hyun-Ik Shin , Hyeong-Wook Choi , Kyu-Woong Lee , Jae-Hoon Lee , Tae-Ho Heo , Ho-Jun Kim , Tae-Sik Kwon , Jeong Hui Seong
IPC分类号： A61K31/42 , C07D261/00 , C07D261/14 , C07D261/18
CPC分类号： C07D261/04 , C07D413/04 , C07D413/12 , C07D413/14
摘要： The present invention relates to an isoxazoline derivative as an inhibitor against various caspases, a process for preparing the same, and a therapeutic composition for preventing inflammation and apoptosis comprising the same.
摘要翻译： 本发明涉及作为对各种胱天蛋白酶的抑制剂的异恶唑啉衍生物，其制备方法以及包含该组合物的用于预防炎症和凋亡的治疗组合物。
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5.发明授权公开(公告)号：US08973566B2
公开(公告)日：2015-03-10
申请号：US13141471
申请日：2009-12-23
申请人： Hee-Dong Park , Nam-Kwang Kim
发明人： Hee-Dong Park , Nam-Kwang Kim
CPC分类号： B28D1/06 , Y10T428/2457
摘要： There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.
摘要翻译： 提供了一种使用框架锯锯切割或钻孔工件的方法，包括大理石和花岗岩，砖，混凝土和沥青等石材。 提供由框架组合锯切割的工件，其包括具有多个切割尖端的一个或多个叶片，或包括不包括切割尖端的叶片; 通过使用框架锯切割工件的方法; 和通过切割方法提供的产品。 工件被设置为包括一个或多个凹槽，多个切割尖端中的至少一个切割尖端的至少一部分或没有切割尖端的至少一部分刀片被插入到该凹槽中，并且其形成在其中。 这里，可以缩短工件上的初始切割时间，以通过显着降低叶片的偏转力来改善框架组合锯片的生产率和产品的质量以及寿命。
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公开(公告)号：US20090229592A1
公开(公告)日：2009-09-17
申请号：US12281004
申请日：2007-02-28
申请人： Soo-Kwang Kim , Hee-Dong Park , Nam-Kwang Kim
发明人： Soo-Kwang Kim , Hee-Dong Park , Nam-Kwang Kim
IPC分类号： B28D1/06
CPC分类号： B28D1/127 , B24D99/005
摘要： A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
摘要翻译： 公开了一种用于切割或钻出诸如石头，砖，混凝土或沥青的脆性工件的切割工具的切割尖端和设置有切割尖端的框架锯。 包括磨料颗粒的摆动式切割尖端具有能够提高磨料颗粒的切割效率的特定布置，从而实现切割性能的提高和寿命的增加。 切割尖端包括多个磨料颗粒以在摆动时切割工件。 研磨颗粒的至少一部分以研磨颗粒组的形式排列。 每个研磨颗粒组由至少两个研磨颗粒构成。 研磨颗粒组的研磨颗粒的至少一部分在切割方向上重叠。
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公开(公告)号：US20080163857A1
公开(公告)日：2008-07-10
申请号：US11908067
申请日：2006-02-13
申请人： Soo-Kwang Kim , Jong-Ho Kim , Hee-Dong Park
发明人： Soo-Kwang Kim , Jong-Ho Kim , Hee-Dong Park
IPC分类号： B23D61/02
摘要： The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
摘要翻译： 本发明提供一种段式金刚石工具，其能够通过在金刚石工具的切割部分中适当地布置金刚石颗粒来提高切割速率并减少在切割期间产生的细碎屑的量。 在本发明中，金刚石颗粒层被布置成使得在切割工件时分别通过金刚石颗粒的引导层分别在其上形成有金刚石颗粒的后续层的工件上形成的切割槽布置在其上形成的切割槽之间。 切割段具有高浓度和低浓度区域。 高浓度区域的浓度高于平均浓度，低浓度区域的浓度低于平均浓度。 此外，在切割段的前部和/或后部形成至少一个低浓度区域。 本发明的金刚石工具确保了切割时产生的优异的切割速度和减少的细碎屑的量。
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8.发明授权公开(公告)号：US07134430B2
公开(公告)日：2006-11-14
申请号：US11010195
申请日：2004-12-09
申请人： Soo-Kwang Kim , Hee-Dong Park
发明人： Soo-Kwang Kim , Hee-Dong Park
CPC分类号： B23D61/18 , B24D99/005 , B28D1/121
摘要： A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
摘要翻译： 公开了一种用于切割或钻孔诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分，制造所述部分的方法和设置有所述片段的切割工具。 所述片段包括垂直于所述片段的切割表面层叠的多个平板状金属基质层，同时平行于所述片段的切割方向，所述板状金属基质层彼此一体地组合并由亚铁制成 或有色金属材料; 以及布置在板状金属基质层之间的金刚石颗粒层，使得可以在切割表面上以阵列形式提供金刚石颗粒。 该片段具有优异的切割能力，并且可以通过简化的制造工艺制造，从而显着降低制造成本。
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公开(公告)号：US08028687B2
公开(公告)日：2011-10-04
申请号：US11908067
申请日：2006-02-13
申请人： Soo-Kwang Kim , Jong-Ho Kim , Hee-Dong Park
发明人： Soo-Kwang Kim , Jong-Ho Kim , Hee-Dong Park
IPC分类号： B28D1/12
摘要： The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
摘要翻译： 本发明提供一种段式金刚石工具，其能够通过在金刚石工具的切割部分中适当地布置金刚石颗粒来提高切割速率并减少在切割期间产生的细碎屑的量。 在本发明中，金刚石颗粒层被布置成使得在切割工件时分别通过金刚石颗粒的引导层分别在其上形成有金刚石颗粒的后续层的工件上形成的切割槽布置在其上形成的切割槽之间。 切割段具有高浓度和低浓度区域。 高浓度区域的浓度高于平均浓度，低浓度区域的浓度低于平均浓度。 此外，在切割段的前部和/或后部形成至少一个低浓度区域。 本发明的金刚石工具确保了切割时产生的优异的切割速度和减少的细碎屑的量。
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10.发明授权Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same 有权切割段，切割段的制造方法和包括该切割段的切削工具公开(公告)号：US08002858B2
公开(公告)日：2011-08-23
申请号：US11911510
申请日：2006-04-14
申请人： Soo-Kwang Kim , Hee-Dong Park
发明人： Soo-Kwang Kim , Hee-Dong Park
CPC分类号： B24D5/123 , B23D61/18 , B23P15/28 , B24D99/005 , B28D1/121
摘要： A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
摘要翻译： 公开了一种用于切割或钻削诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分，该部分的制造方法以及包括该部分的切割工具。 该段包括金刚石颗粒层和包含具有不同延展性的软和硬金属基质层的两种板状金属基质层。 板状金属基体层与切割面垂直配置，同时平行于切割方向，并且交替地垂直于切割方向堆叠。 金刚石颗粒层适当地布置在板状软和硬金属基质层中。 该片段和包括该切割工具的切割工具具有优异的切割能力，并且可以简化其制造工艺，从而显着提高生产率。
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